IC 소켓

제조업체 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도

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결과
사진 제조사 부품 번호 재고 상태 가격 수량 데이터시트 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도
APH-1436-G-T

APH-1436-G-T

APH-1436-G-T

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1536-G-T

APH-1536-G-T

APH-1536-G-T

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0636-G-T

APH-0636-G-T

APH-0636-G-T

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0836-G-T

APH-0836-G-T

APH-0836-G-T

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1636-G-T

APH-1636-G-T

APH-1636-G-T

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
514-83-292M20-001148

514-83-292M20-001148

CONN SOCKET BGA 292POS GOLD

Preci-Dip

0 -
RFQ
514-83-292M20-001148

데이터시트

514 Bulk Active BGA 292 (20 x 20) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
APO-632-G-T

APO-632-G-T

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
101-PGM13022-10H

101-PGM13022-10H

CONN SOCKET PGA GOLD

Aries Electronics

0 -
RFQ
101-PGM13022-10H

데이터시트

PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
546-87-419-19-111147

546-87-419-19-111147

CONN SOCKET PGA 419POS GOLD

Preci-Dip

0 -
RFQ
546-87-419-19-111147

데이터시트

546 Bulk Active PGA 419 (19 x 19) 0.050" (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
160-PGM14029-40

160-PGM14029-40

CONN SOCKET PGA GOLD

Aries Electronics

0 -
RFQ
160-PGM14029-40

데이터시트

PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
546-83-321-17-101147

546-83-321-17-101147

CONN SOCKET PGA 321POS GOLD

Preci-Dip

0 -
RFQ
546-83-321-17-101147

데이터시트

546 Bulk Active PGA 321 (17 x 17) 0.050" (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
546-87-420-19-111147

546-87-420-19-111147

CONN SOCKET PGA 420POS GOLD

Preci-Dip

0 -
RFQ
546-87-420-19-111147

데이터시트

546 Bulk Active PGA 420 (19 x 19) 0.050" (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-93-241-18-075002

510-93-241-18-075002

CONN SOCKET PGA 241POS GOLD

Mill-Max Manufacturing Corp.

0 -
RFQ
510-93-241-18-075002

데이터시트

510 Tube Active PGA 241 (18 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
60-9503-21

60-9503-21

CONN IC DIP SOCKET 60POS GOLD

Aries Electronics

0 -
RFQ
60-9503-21

데이터시트

503 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 60 (2 x 30) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
60-9503-31

60-9503-31

CONN IC DIP SOCKET 60POS GOLD

Aries Electronics

0 -
RFQ
60-9503-31

데이터시트

503 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 60 (2 x 30) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
100-PGM10001-51

100-PGM10001-51

CONN SOCKET PGA GOLD

Aries Electronics

0 -
RFQ
100-PGM10001-51

데이터시트

PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
108-PGM12005-41

108-PGM12005-41

CONN SOCKET PGA GOLD

Aries Electronics

0 -
RFQ
108-PGM12005-41

데이터시트

PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
52-536-11

52-536-11

CONN SOCKET PLCC ZIF 52POS GOLD

Aries Electronics

0 -
RFQ

-

536 - Obsolete PLCC, ZIF (ZIP) 52 (4 x 13) 0.050" (1.27mm) Gold 12.0µin (0.30µm) - Through Hole Open Frame - - - - - - -
32-536-11

32-536-11

CONN SOCKET PLCC ZIF 32POS GOLD

Aries Electronics

0 -
RFQ

-

536 - Obsolete PLCC, ZIF (ZIP) 32 (2 x 7, 2 x 9) 0.050" (1.27mm) Gold 12.0µin (0.30µm) - Through Hole Open Frame - - - - - - -
APH-1834-G-R

APH-1834-G-R

APH-1834-G-R

Samtec Inc.

0 -
RFQ

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* - Active - - - - - - - - - - - - - - -
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