IC 소켓

제조업체 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도

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결과
사진 제조사 부품 번호 재고 상태 가격 수량 데이터시트 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도
144-PGM13095-11

144-PGM13095-11

CONN SOCKET PGA GOLD

Aries Electronics

0 -
RFQ
144-PGM13095-11

데이터시트

PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
28-3552-16

28-3552-16

CONN IC DIP SOCKET ZIF 28POS

Aries Electronics

0 -
RFQ
28-3552-16

데이터시트

55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
APH-0532-G-R

APH-0532-G-R

APH-0532-G-R

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0932-G-R

APH-0932-G-R

APH-0932-G-R

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0632-G-R

APH-0632-G-R

APH-0632-G-R

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0332-G-R

APH-0332-G-R

APH-0332-G-R

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1732-G-R

APH-1732-G-R

APH-1732-G-R

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0832-G-R

APH-0832-G-R

APH-0832-G-R

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
232-1270-01-0602

232-1270-01-0602

CONN SOCKET PGA ZIF 32POS GOLD

3M

0 -
RFQ
232-1270-01-0602

데이터시트

Textool™ Bulk Obsolete PGA, ZIF (ZIP) 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
232-1270-02-0602

232-1270-02-0602

CONN SOCKET PGA ZIF 32POS GOLD

3M

0 -
RFQ
232-1270-02-0602

데이터시트

Textool™ Bulk Obsolete PGA, ZIF (ZIP) 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
517-83-529-21-121111

517-83-529-21-121111

CONN SOCKET PGA 529POS GOLD

Preci-Dip

0 -
RFQ
517-83-529-21-121111

데이터시트

517 Bulk Active PGA 529 (21 x 21) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
232-1270-51-0602

232-1270-51-0602

STAGGERED ZIP STRIP POCKETS 32 C

3M

0 -
RFQ

-

Textool™ - Obsolete - - - - - - - - - - - - - - -
546-87-403-19-111147

546-87-403-19-111147

CONN SOCKET PGA 403POS GOLD

Preci-Dip

0 -
RFQ
546-87-403-19-111147

데이터시트

546 Bulk Active PGA 403 (19 x 19) 0.050" (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-93-223-18-095002

510-93-223-18-095002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

0 -
RFQ
510-93-223-18-095002

데이터시트

510 Tube Active PGA 223 (18 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
510-13-121-11-000002

510-13-121-11-000002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

0 -
RFQ
510-13-121-11-000002

데이터시트

510 Bulk Active PGA 121 (11 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
510-13-121-11-000003

510-13-121-11-000003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

0 -
RFQ
510-13-121-11-000003

데이터시트

510 Bulk Active PGA 121 (11 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
24-3572-16

24-3572-16

CONN IC DIP SOCKET ZIF 24POS

Aries Electronics

0 -
RFQ
24-3572-16

데이터시트

57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled -
116-43-964-61-001000

116-43-964-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
RFQ

-

116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-93-964-61-001000

116-93-964-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
RFQ

-

116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
28-6556-41

28-6556-41

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

0 -
RFQ
28-6556-41

데이터시트

6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder Cup 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
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