24시간 이용 가능:
0755-82798135IC 소켓
| 사진 | 제조사 부품 번호 | 재고 상태 | 가격 | 수량 | 데이터시트 | 시리즈 | 패키징 | 제품 상태 | 유형 | 위치 또는 핀 수(그리드) | 피치 - Mating | 접촉 마감 - 결합 | 접촉 마감 두께 - Mating | 접촉 재료 - Mating | 장착 유형 | 기능 | 종단 | 피치 - 포스트 | 접촉 마감 - 포스트 | 접촉 마감 두께 - 포스트 | 접촉 재료 - 포스트 | 하우징 소재 | 작동 온도 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
514-83-272M20-001148CONN SOCKET BGA 272POS GOLD |
0 | - |
|
데이터시트 |
514 | Bulk | Active | BGA | 272 (20 x 20) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
210-2599-50-06023M TEXTOOL ZIP STRIP SOCKETS 210 |
0 | - |
|
- |
Textool™ | Box | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
514-83-299-20-001117CONN SOCKET PGA 299POS GOLD |
0 | - |
|
데이터시트 |
514 | Bulk | Active | PGA | 299 (20 x 20) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
514-87-352M26-001148CONN SOCKET BGA 352POS GOLD |
0 | - |
|
데이터시트 |
514 | Bulk | Active | BGA | 352 (26 x 26) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
192-PGM17043-11HCONN SOCKET PGA GOLD |
0 | - |
|
데이터시트 |
PGM | Bulk | Active | PGA | - | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 125°C |
|
550-10-256M20-001152BGA SOLDER TAIL |
0 | - |
|
데이터시트 |
550 | Bulk | Active | BGA | 256 (20 x 20) | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | Through Hole | Closed Frame | Solder | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
|
550-10-256M16-000152BGA SOLDER TAIL |
0 | - |
|
데이터시트 |
550 | Bulk | Active | BGA | 256 (16 x 16) | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | Through Hole | Closed Frame | Solder | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
|
517-83-545-17-000111CONN SOCKET PGA 545POS GOLD |
0 | - |
|
데이터시트 |
517 | Bulk | Active | PGA | 545 (17 x 17) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
546-87-391-18-101147CONN SOCKET PGA 391POS GOLD |
0 | - |
|
데이터시트 |
546 | Bulk | Active | PGA | 391 (18 x 18) | 0.050" (1.27mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Press-Fit | 0.100" (2.54mm) | Tin | - | Bronze | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
510-91-256-16-000001SKT PGA SOLDRTL |
0 | - |
|
데이터시트 |
510 | Bulk | Active | PGA | 256 (16 x 16) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
40-6508-21CONN IC DIP SOCKET 40POS GOLD |
0 | - |
|
데이터시트 |
508 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 125°C |
|
40-6508-31CONN IC DIP SOCKET 40POS GOLD |
0 | - |
|
데이터시트 |
508 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 125°C |
|
514-87-356M26-001148CONN SOCKET BGA 356POS GOLD |
0 | - |
|
데이터시트 |
514 | Bulk | Active | BGA | 356 (26 x 26) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
510-91-241-18-075003SKT PGA SOLDRTL |
0 | - |
|
데이터시트 |
510 | Bulk | Active | PGA | 241 (18 x 18) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
APH-0534-G-TAPH-0534-G-T |
0 | - |
|
- |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
APH-1034-G-TAPH-1034-G-T |
0 | - |
|
- |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
APH-1434-G-TAPH-1434-G-T |
0 | - |
|
- |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
APH-1234-G-TAPH-1234-G-T |
0 | - |
|
- |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
APH-0434-G-TAPH-0434-G-T |
0 | - |
|
- |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
APH-1634-G-TAPH-1634-G-T |
0 | - |
|
- |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |

