IC 소켓

제조업체 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도

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결과
사진 제조사 부품 번호 재고 상태 가격 수량 데이터시트 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도
514-83-272M20-001148

514-83-272M20-001148

CONN SOCKET BGA 272POS GOLD

Preci-Dip

0 -
RFQ
514-83-272M20-001148

데이터시트

514 Bulk Active BGA 272 (20 x 20) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
210-2599-50-0602

210-2599-50-0602

3M TEXTOOL ZIP STRIP SOCKETS 210

3M

0 -
RFQ

-

Textool™ Box Active - - - - - - - - - - - - - - -
514-83-299-20-001117

514-83-299-20-001117

CONN SOCKET PGA 299POS GOLD

Preci-Dip

0 -
RFQ
514-83-299-20-001117

데이터시트

514 Bulk Active PGA 299 (20 x 20) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
514-87-352M26-001148

514-87-352M26-001148

CONN SOCKET BGA 352POS GOLD

Preci-Dip

0 -
RFQ
514-87-352M26-001148

데이터시트

514 Bulk Active BGA 352 (26 x 26) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
192-PGM17043-11H

192-PGM17043-11H

CONN SOCKET PGA GOLD

Aries Electronics

0 -
RFQ
192-PGM17043-11H

데이터시트

PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
550-10-256M20-001152

550-10-256M20-001152

BGA SOLDER TAIL

Preci-Dip

0 -
RFQ
550-10-256M20-001152

데이터시트

550 Bulk Active BGA 256 (20 x 20) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
550-10-256M16-000152

550-10-256M16-000152

BGA SOLDER TAIL

Preci-Dip

0 -
RFQ
550-10-256M16-000152

데이터시트

550 Bulk Active BGA 256 (16 x 16) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
517-83-545-17-000111

517-83-545-17-000111

CONN SOCKET PGA 545POS GOLD

Preci-Dip

0 -
RFQ
517-83-545-17-000111

데이터시트

517 Bulk Active PGA 545 (17 x 17) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
546-87-391-18-101147

546-87-391-18-101147

CONN SOCKET PGA 391POS GOLD

Preci-Dip

0 -
RFQ
546-87-391-18-101147

데이터시트

546 Bulk Active PGA 391 (18 x 18) 0.050" (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-91-256-16-000001

510-91-256-16-000001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

0 -
RFQ
510-91-256-16-000001

데이터시트

510 Bulk Active PGA 256 (16 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
40-6508-21

40-6508-21

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

0 -
RFQ
40-6508-21

데이터시트

508 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
40-6508-31

40-6508-31

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

0 -
RFQ
40-6508-31

데이터시트

508 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
514-87-356M26-001148

514-87-356M26-001148

CONN SOCKET BGA 356POS GOLD

Preci-Dip

0 -
RFQ
514-87-356M26-001148

데이터시트

514 Bulk Active BGA 356 (26 x 26) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-91-241-18-075003

510-91-241-18-075003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

0 -
RFQ
510-91-241-18-075003

데이터시트

510 Bulk Active PGA 241 (18 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
APH-0534-G-T

APH-0534-G-T

APH-0534-G-T

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1034-G-T

APH-1034-G-T

APH-1034-G-T

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1434-G-T

APH-1434-G-T

APH-1434-G-T

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1234-G-T

APH-1234-G-T

APH-1234-G-T

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0434-G-T

APH-0434-G-T

APH-0434-G-T

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1634-G-T

APH-1634-G-T

APH-1634-G-T

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
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