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| 사진 | 제조사 부품 번호 | 재고 상태 | 가격 | 수량 | 데이터시트 | 시리즈 | 패키징 | 제품 상태 | 유형 | 위치 또는 핀 수(그리드) | 피치 - Mating | 접촉 마감 - 결합 | 접촉 마감 두께 - Mating | 접촉 재료 - Mating | 장착 유형 | 기능 | 종단 | 피치 - 포스트 | 접촉 마감 - 포스트 | 접촉 마감 두께 - 포스트 | 접촉 재료 - 포스트 | 하우징 소재 | 작동 온도 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
510-13-100-10-000001SKT PGA SOLDRTL |
0 | - |
|
데이터시트 |
510 | Bulk | Active | PGA | 100 (10 x 10) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
550-10-357M19-001166BGA PIN ADAPTER 1.27MM SMD |
0 | - |
|
데이터시트 |
550 | Bulk | Active | BGA | 357 (19 x 19) | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
|
APH-1338-G-RAPH-1338-G-R |
0 | - |
|
- |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
APH-1838-G-RAPH-1838-G-R |
0 | - |
|
- |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
APH-0938-G-RAPH-0938-G-R |
0 | - |
|
- |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
APH-1038-G-RAPH-1038-G-R |
0 | - |
|
- |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
APH-1938-G-RAPH-1938-G-R |
0 | - |
|
- |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
APH-0238-G-RAPH-0238-G-R |
0 | - |
|
- |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
APH-0838-G-RAPH-0838-G-R |
0 | - |
|
- |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
APH-0738-G-RAPH-0738-G-R |
0 | - |
|
- |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
APH-0438-G-RAPH-0438-G-R |
0 | - |
|
- |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
APH-1738-G-RAPH-1738-G-R |
0 | - |
|
- |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
514-83-419-19-001154CONN SOCKET PGA 419POS GOLD |
0 | - |
|
데이터시트 |
514 | Bulk | Active | PGA | 419 (19 x 19) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
HLS-1008-G-2.100" SCREW MACHINE SOCKET ARRAY |
0 | - |
|
데이터시트 |
HLS | Bulk | Active | SIP | 80 (10 x 8) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | - | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | - | Thermoplastic | -55°C ~ 140°C |
|
510-13-101-13-061001SKT PGA SOLDRTL |
0 | - |
|
데이터시트 |
510 | Bulk | Active | PGA | 101 (13 x 13) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
550-10-241-18-071101PGA SOLDER TAIL |
0 | - |
|
데이터시트 |
550 | Bulk | Active | PGA | 241 (18 x 18) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
510-91-225-15-000003SKT PGA SOLDRTL |
0 | - |
|
데이터시트 |
510 | Bulk | Active | PGA | 225 (15 x 15) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
550-10-360M19-001166BGA PIN ADAPTER 1.27MM SMD |
0 | - |
|
데이터시트 |
550 | Bulk | Active | BGA | 360 (19 x 19) | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
|
24-6556-41CONN IC DIP SOCKET 24POS GOLD |
0 | - |
|
데이터시트 |
6556 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder Cup | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyphenylene Sulfide (PPS), Glass Filled | - |
|
APH-0840-G-HAPH-0840-G-H |
0 | - |
|
- |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
