IC 소켓

제조업체 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도

모두 초기화
모두 적용
결과
사진 제조사 부품 번호 재고 상태 가격 수량 데이터시트 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도
APH-1836-G-H

APH-1836-G-H

APH-1836-G-H

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1536-G-H

APH-1536-G-H

APH-1536-G-H

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0636-G-H

APH-0636-G-H

APH-0636-G-H

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
255-7322-01-0602

255-7322-01-0602

3M TEXTOOL ZIP STRIP SOCKETS 255

3M

0 -
RFQ

-

Textool™ Box Obsolete - - - - - - - - - - - - - - -
255-7322-02-0602

255-7322-02-0602

3M TEXTOOL ZIP STRIP SOCKETS 255

3M

0 -
RFQ

-

Textool™ Box Obsolete - - - - - - - - - - - - - - -
514-87-388M26-001148

514-87-388M26-001148

CONN SOCKET BGA 388POS GOLD

Preci-Dip

0 -
RFQ
514-87-388M26-001148

데이터시트

514 Bulk Active BGA 388 (26 x 26) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
614-83-279-19-081112

614-83-279-19-081112

CONN SOCKET PGA 279POS GOLD

Preci-Dip

0 -
RFQ
614-83-279-19-081112

데이터시트

614 Bulk Active PGA 279 (19 x 19) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
546-83-320-19-131147

546-83-320-19-131147

CONN SOCKET PGA 320POS GOLD

Preci-Dip

0 -
RFQ
546-83-320-19-131147

데이터시트

546 Bulk Active PGA 320 (19 x 19) 0.050" (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
614-83-281-19-001112

614-83-281-19-001112

CONN SOCKET PGA 281POS GOLD

Preci-Dip

0 -
RFQ
614-83-281-19-001112

데이터시트

614 Bulk Active PGA 281 (19 x 19) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
APH-0538-G-T

APH-0538-G-T

APH-0538-G-T

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1238-G-T

APH-1238-G-T

APH-1238-G-T

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0838-G-T

APH-0838-G-T

APH-0838-G-T

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1638-G-T

APH-1638-G-T

APH-1638-G-T

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
546-83-321-19-121147

546-83-321-19-121147

CONN SOCKET PGA 321POS GOLD

Preci-Dip

0 -
RFQ
546-83-321-19-121147

데이터시트

546 Bulk Active PGA 321 (19 x 19) 0.050" (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
558-10-255M16-001104

558-10-255M16-001104

BGA SURFACE MOUNT 1.27MM

Preci-Dip

0 -
RFQ
558-10-255M16-001104

데이터시트

558 Bulk Active BGA 255 (16 x 16) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass Surface Mount Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
558-10-256M16-000104

558-10-256M16-000104

BGA SURFACE MOUNT 1.27MM

Preci-Dip

0 -
RFQ
558-10-256M16-000104

데이터시트

558 Bulk Active BGA 256 (16 x 16) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass Surface Mount Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
558-10-256M20-001104

558-10-256M20-001104

BGA SURFACE MOUNT 1.27MM

Preci-Dip

0 -
RFQ
558-10-256M20-001104

데이터시트

558 Bulk Active BGA 256 (20 x 20) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass Surface Mount Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
518-77-255M16-001105

518-77-255M16-001105

CONN SOCKET PGA 255POS GOLD

Preci-Dip

0 -
RFQ
518-77-255M16-001105

데이터시트

518 Bulk Active PGA 255 (16 x 16) 0.050" (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.050" (1.27mm) Gold Flash Brass FR4 Epoxy Glass -55°C ~ 125°C
558-10-272M20-001101

558-10-272M20-001101

PGA SOLDER TAIL 1.27MM

Preci-Dip

0 -
RFQ
558-10-272M20-001101

데이터시트

558 Bulk Active PGA 272 (20 x 20) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
550-80-381-18-101135

550-80-381-18-101135

PGA SOLDER TAIL

Preci-Dip

0 -
RFQ
550-80-381-18-101135

데이터시트

550 Bulk Active PGA 381 (18 x 18) 0.050" (1.27mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.050" (1.27mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
Total 19086 Record«Prev1... 872873874875876877878879...955Next»
TomatoElec

검색

TomatoElec

제품

TomatoElec

전화번호

TomatoElec

사용자