IC 소켓

제조업체 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도

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결과
사진 제조사 부품 번호 재고 상태 가격 수량 데이터시트 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도
APH-0938-G-H

APH-0938-G-H

APH-0938-G-H

Samtec Inc.

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RFQ

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APH-1738-G-H

APH-1738-G-H

APH-1738-G-H

Samtec Inc.

0 -
RFQ

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APH-0438-G-H

APH-0438-G-H

APH-0438-G-H

Samtec Inc.

0 -
RFQ

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* - Active - - - - - - - - - - - - - - -
APH-1138-G-H

APH-1138-G-H

APH-1138-G-H

Samtec Inc.

0 -
RFQ

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32-6556-41

32-6556-41

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

0 -
RFQ
32-6556-41

데이터시트

6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder Cup 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
124-PGM13008-41

124-PGM13008-41

CONN SOCKET PGA GOLD

Aries Electronics

0 -
RFQ
124-PGM13008-41

데이터시트

PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
24-6553-16

24-6553-16

CONN IC DIP SOCKET ZIF 24POS

Aries Electronics

0 -
RFQ
24-6553-16

데이터시트

55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
36-6556-40

36-6556-40

CONN IC DIP SOCKET 36POS GOLD

Aries Electronics

0 -
RFQ
36-6556-40

데이터시트

6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder Cup 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
APH-1440-G-T

APH-1440-G-T

APH-1440-G-T

Samtec Inc.

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RFQ

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APH-1940-G-T

APH-1940-G-T

APH-1940-G-T

Samtec Inc.

0 -
RFQ

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APH-1540-G-T

APH-1540-G-T

APH-1540-G-T

Samtec Inc.

0 -
RFQ

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* - Active - - - - - - - - - - - - - - -
APH-1040-G-T

APH-1040-G-T

APH-1040-G-T

Samtec Inc.

0 -
RFQ

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* - Active - - - - - - - - - - - - - - -
APH-0240-G-T

APH-0240-G-T

APH-0240-G-T

Samtec Inc.

0 -
RFQ

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* - Active - - - - - - - - - - - - - - -
APH-0340-G-T

APH-0340-G-T

APH-0340-G-T

Samtec Inc.

0 -
RFQ

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APH-1240-G-T

APH-1240-G-T

APH-1240-G-T

Samtec Inc.

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RFQ

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APH-1640-G-T

APH-1640-G-T

APH-1640-G-T

Samtec Inc.

0 -
RFQ

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550-10-432M31-001166

550-10-432M31-001166

BGA PIN ADAPTER 1.27MM SMD

Preci-Dip

0 -
RFQ
550-10-432M31-001166

데이터시트

550 Bulk Active BGA 432 (31 x 31) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
192-PGM17025-11

192-PGM17025-11

CONN SOCKET PGA GOLD

Aries Electronics

0 -
RFQ
192-PGM17025-11

데이터시트

PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
546-87-463-19-101147

546-87-463-19-101147

CONN SOCKET PGA 463POS GOLD

Preci-Dip

0 -
RFQ
546-87-463-19-101147

데이터시트

546 Bulk Active PGA 463 (19 x 19) 0.050" (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
614-83-299-20-001112

614-83-299-20-001112

CONN SOCKET PGA 299POS GOLD

Preci-Dip

0 -
RFQ
614-83-299-20-001112

데이터시트

614 Bulk Active PGA 299 (20 x 20) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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