IC 소켓

제조업체 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도

모두 초기화
모두 적용
결과
사진 제조사 부품 번호 재고 상태 가격 수량 데이터시트 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도
24-3554-16

24-3554-16

CONN IC DIP SOCKET ZIF 24POS

Aries Electronics

0 -
RFQ
24-3554-16

데이터시트

55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
614-87-320-19-131144

614-87-320-19-131144

CONN SOCKET PGA 320POS GOLD

Preci-Dip

0 -
RFQ
614-87-320-19-131144

데이터시트

614 Bulk Active PGA 320 (19 x 19) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
614-87-321-19-121144

614-87-321-19-121144

CONN SOCKET PGA 321POS GOLD

Preci-Dip

0 -
RFQ
614-87-321-19-121144

데이터시트

614 Bulk Active PGA 321 (19 x 19) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
550-10-456M26-001166

550-10-456M26-001166

BGA PIN ADAPTER 1.27MM SMD

Preci-Dip

0 -
RFQ
550-10-456M26-001166

데이터시트

550 Bulk Active BGA 456 (26 x 26) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
APH-1940-G-R

APH-1940-G-R

APH-1940-G-R

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0340-G-R

APH-0340-G-R

APH-0340-G-R

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1640-G-R

APH-1640-G-R

APH-1640-G-R

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
614-87-325-18-111144

614-87-325-18-111144

CONN SOCKET PGA 325POS GOLD

Preci-Dip

0 -
RFQ
614-87-325-18-111144

데이터시트

614 Bulk Active PGA 325 (18 x 18) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
546-87-296-19-131147

546-87-296-19-131147

CONN SOCKET PGA 296POS GOLD

Preci-Dip

0 -
RFQ
546-87-296-19-131147

데이터시트

546 Bulk Active PGA 296 (19 x 19) 0.050" (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
546-83-391-18-101147

546-83-391-18-101147

CONN SOCKET PGA 391POS GOLD

Preci-Dip

0 -
RFQ
546-83-391-18-101147

데이터시트

546 Bulk Active PGA 391 (18 x 18) 0.050" (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
28-6554-16

28-6554-16

CONN IC DIP SOCKET ZIF 28POS

Aries Electronics

0 -
RFQ
28-6554-16

데이터시트

55 Tube Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
28-6552-16

28-6552-16

CONN IC DIP SOCKET ZIF 28POS

Aries Electronics

0 -
RFQ
28-6552-16

데이터시트

55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
28-3554-16

28-3554-16

CONN IC DIP SOCKET ZIF 24POS

Aries Electronics

0 -
RFQ
28-3554-16

데이터시트

55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -55°C ~ 250°C
558-10-292M20-001104

558-10-292M20-001104

BGA SURFACE MOUNT 1.27MM

Preci-Dip

0 -
RFQ
558-10-292M20-001104

데이터시트

558 Bulk Active BGA 292 (20 x 20) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass Surface Mount Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
224-5809-50-0602

224-5809-50-0602

3M TEXTOOL ZIP STRIP SOCKETS 224

3M

0 -
RFQ

-

Textool™ Box Active SIP, ZIF (ZIP) 24 (1 x 24) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
APA-648-G-B

APA-648-G-B

ADAPTER PLUG

Samtec Inc.

0 -
RFQ
APA-648-G-B

데이터시트

APA Bulk Active - 48 (2 x 24) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
239-5605-01-0602

239-5605-01-0602

CONN ZIG-ZAG 39POS GOLD

3M

0 -
RFQ
239-5605-01-0602

데이터시트

- Bulk Obsolete Zig-Zag 39 (1 x 19, 1 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 150°C
232-2601-50-0602

232-2601-50-0602

IN-LINE ZIP STRIP POCKETS 32 CON

3M

0 -
RFQ

-

- Bulk Active - - - - - - - - - - - - - - -
518-77-292M20-001105

518-77-292M20-001105

CONN SOCKET PGA 292POS GOLD

Preci-Dip

0 -
RFQ
518-77-292M20-001105

데이터시트

518 Bulk Active PGA 292 (20 x 20) 0.050" (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.050" (1.27mm) Gold Flash Brass FR4 Epoxy Glass -55°C ~ 125°C
517-83-685-19-000111

517-83-685-19-000111

CONN SOCKET PGA 685POS GOLD

Preci-Dip

0 -
RFQ
517-83-685-19-000111

데이터시트

517 Bulk Active PGA 685 (19 x 19) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
Total 19086 Record«Prev1... 877878879880881882883884...955Next»
TomatoElec

검색

TomatoElec

제품

TomatoElec

전화번호

TomatoElec

사용자