IC 소켓

제조업체 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도

모두 초기화
모두 적용
결과
사진 제조사 부품 번호 재고 상태 가격 수량 데이터시트 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도
AW 127-13/Z-T

AW 127-13/Z-T

SOCKET 13 CONTACTS SINGLE ROW

Assmann WSW Components

0 -
RFQ
AW 127-13/Z-T

데이터시트

- - Active - - - - - - - - - - - - - - -
SIP1X07-014B

SIP1X07-014B

SIP1X07-014B-SIP SOCKET 7 CTS

Amphenol ICC (FCI)

0 -
RFQ
SIP1X07-014B

데이터시트

SIP1x Bulk Active SIP 7 (1 x 7) 0.100" (2.54mm) Tin-Lead 150.0µin (3.81µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
SIP1X06-001B

SIP1X06-001B

SIP1X06-001B-SIP SOCKET 6 CTS

Amphenol ICC (FCI)

0 -
RFQ
SIP1X06-001B

데이터시트

SIP1x Bulk Active SIP 6 (1 x 6) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
116-87-304-41-006101

116-87-304-41-006101

CONN IC DIP SOCKET 4POS GOLD

Preci-Dip

0 -
RFQ
116-87-304-41-006101

데이터시트

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
232-20

232-20

CONN SOCKET PLCC 20POS TIN

CNC Tech

0 -
RFQ
232-20

데이터시트

- Tube Obsolete PLCC 20 (4 x 5) 0.050" (1.27mm) Tin 100.0µin (2.54µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 100.0µin (2.54µm) Phosphor Bronze Polyphenylene Sulfide (PPS), Glass Filled -55°C ~ 105°C
02-1518-10

02-1518-10

CONN IC DIP SOCKET 2POS GOLD

Aries Electronics

0 -
RFQ
02-1518-10

데이터시트

518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 2 (1 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
SIP41430-001LF

SIP41430-001LF

CONN SOCKET SIP 2POS TIN

Amphenol ICC (FCI)

0 -
RFQ
SIP41430-001LF

데이터시트

- Tape & Reel (TR) Obsolete SIP 2 (1 x 2) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyamide (PA), Nylon -
A 28-LC/7-T

A 28-LC/7-T

CONN IC DIP SOCKET 28POS TIN

Assmann WSW Components

0 -
RFQ
A 28-LC/7-T

데이터시트

- Box Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Polybutylene Terephthalate (PBT) -55°C ~ 85°C
232-32

232-32

CONN SOCKET PLCC 32POS TIN

CNC Tech

0 -
RFQ
232-32

데이터시트

- Tube Obsolete PLCC 32 (4 x 8) 0.050" (1.27mm) Tin 100.0µin (2.54µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 100.0µin (2.54µm) Phosphor Bronze Polyphenylene Sulfide (PPS), Glass Filled -55°C ~ 105°C
AW 127-14/Z-T

AW 127-14/Z-T

SOCKET 14 CONTACTS SINGLE ROW

Assmann WSW Components

0 -
RFQ
AW 127-14/Z-T

데이터시트

- - Active - - - - - - - - - - - - - - -
SIP050-1X04-157B

SIP050-1X04-157B

1X04-157B-SIP SOCKET 4 CTS

Amphenol ICC (FCI)

0 -
RFQ
SIP050-1X04-157B

데이터시트

SIP050-1x Bulk Active SIP 4 (1 x 4) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
116-87-304-41-018101

116-87-304-41-018101

CONN IC DIP SOCKET 4POS GOLD

Preci-Dip

0 -
RFQ
116-87-304-41-018101

데이터시트

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
SIP1X07-011B

SIP1X07-011B

SIP1X07-011B-SIP SOCKET 7 CTS

Amphenol ICC (FCI)

0 -
RFQ
SIP1X07-011B

데이터시트

SIP1x Bulk Active SIP 7 (1 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
115-83-304-41-001101

115-83-304-41-001101

CONN IC DIP SOCKET 4POS GOLD

Preci-Dip

0 -
RFQ

-

115 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
AR06-HZL/07-TT

AR06-HZL/07-TT

CONN IC DIP SOCKET 6POS GOLD

Assmann WSW Components

0 -
RFQ
AR06-HZL/07-TT

데이터시트

- Bag Obsolete DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
232-28

232-28

CONN SOCKET PLCC 28POS TIN

CNC Tech

0 -
RFQ
232-28

데이터시트

- Tube Obsolete PLCC 28 (4 x 7) 0.050" (1.27mm) Tin 100.0µin (2.54µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 100.0µin (2.54µm) Phosphor Bronze Polyphenylene Sulfide (PPS), Glass Filled -55°C ~ 105°C
A16-LCG

A16-LCG

CONN IC DIP SOCKET 16POS GOLD

Assmann WSW Components

0 -
RFQ

-

- - Obsolete DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold - - Through Hole Open Frame - 0.100" (2.54mm) Gold - - - -
AR08-HZL/01-TT

AR08-HZL/01-TT

CONN IC DIP SOCKET 8POS GOLD

Assmann WSW Components

0 -
RFQ
AR08-HZL/01-TT

데이터시트

- Bag Obsolete DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
HLS-0101-T-2

HLS-0101-T-2

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
RFQ
HLS-0101-T-2

데이터시트

HLS Tube Active SIP 1 (1 x 1) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
614-87-304-31-012101

614-87-304-31-012101

CONN IC DIP SOCKET 320POS GOLD

Preci-Dip

0 -
RFQ
614-87-304-31-012101

데이터시트

614 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 320 (19 x 19) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
Total 19086 Record«Prev1... 8182838485868788...955Next»
TomatoElec

검색

TomatoElec

제품

TomatoElec

전화번호

TomatoElec

사용자