IC 소켓

제조업체 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도

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결과
사진 제조사 부품 번호 재고 상태 가격 수량 데이터시트 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도
WMS-140Z

WMS-140Z

CONN IC DIP SOCKET 14POS GOLD

On Shore Technology Inc.

0 -
RFQ
WMS-140Z

데이터시트

WMS Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame, Wash Away Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass - -40°C ~ 105°C
A-CCS20-Z-SM

A-CCS20-Z-SM

CONN SOCKET PLCC 20POS TIN

Assmann WSW Components

0 -
RFQ
A-CCS20-Z-SM

데이터시트

- Bag Obsolete PLCC 20 (4 x 5) 0.050" (1.27mm) Tin 150.0µin (3.81µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 150.0µin (3.81µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 105°C
03-0518-10

03-0518-10

CONN SOCKET SIP 3POS GOLD

Aries Electronics

0 -
RFQ
03-0518-10

데이터시트

518 Bulk Active SIP 3 (1 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
01-0513-11H

01-0513-11H

CONN SOCKET SIP 1POS GOLD

Aries Electronics

0 -
RFQ
01-0513-11H

데이터시트

0513 Bulk Active SIP 1 (1 x 1) - Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
03-0518-00

03-0518-00

CONN SOCKET SIP 3POS GOLD

Aries Electronics

0 -
RFQ
03-0518-00

데이터시트

518 Bulk Active SIP 3 (1 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
02-0518-11

02-0518-11

CONN SOCKET SIP 2POS GOLD

Aries Electronics

0 -
RFQ
02-0518-11

데이터시트

518 Bulk Active SIP 2 (1 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
02-1518-11

02-1518-11

CONN IC DIP SOCKET 2POS GOLD

Aries Electronics

0 -
RFQ
02-1518-11

데이터시트

518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 2 (1 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
SIP1X10-011B

SIP1X10-011B

SIP1X10-011B-SIP SOCKET 10 CTS

Amphenol ICC (FCI)

0 -
RFQ
SIP1X10-011B

데이터시트

SIP1x Bulk Active SIP 10 (1 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
SIP1X08-001B

SIP1X08-001B

SIP1X08-001B-SIP SOCKET 8 CTS

Amphenol ICC (FCI)

0 -
RFQ
SIP1X08-001B

데이터시트

SIP1x Bulk Active SIP 8 (1 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
HLS-0101-T-31

HLS-0101-T-31

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
RFQ
HLS-0101-T-31

데이터시트

HLS Tube Active SIP 1 (1 x 1) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
614-83-304-41-001101

614-83-304-41-001101

CONN IC DIP SOCKET 4POS GOLD

Preci-Dip

0 -
RFQ
614-83-304-41-001101

데이터시트

614 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
110-87-308-41-605101

110-87-308-41-605101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip

0 -
RFQ
110-87-308-41-605101

데이터시트

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
4824-3004-CP

4824-3004-CP

CONN IC DIP SOCKET 24POS TIN

3M

0 -
RFQ
4824-3004-CP

데이터시트

4800 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin 35.4µin (0.90µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin 35.0µin (0.90µm) Phosphor Bronze Polyester, Glass Filled -25°C ~ 85°C
241-08-1-03

241-08-1-03

CONN IC DIP SOCKET 8POS TIN

CNC Tech

0 -
RFQ
241-08-1-03

데이터시트

- Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
02-0513-10T

02-0513-10T

CONN SOCKET SIP 2POS GOLD

Aries Electronics

0 -
RFQ
02-0513-10T

데이터시트

0513 Bulk Active SIP 2 (1 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
DIP314-011B

DIP314-011B

DIP SOCKET 14 CTS

Amphenol ICC (FCI)

0 -
RFQ
DIP314-011B

데이터시트

- Bag Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
A20-LCG

A20-LCG

CONN IC DIP SOCKET 20POS GOLD

Assmann WSW Components

0 -
RFQ

-

- - Obsolete DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold - - Through Hole Open Frame - 0.100" (2.54mm) Gold - - - -
110-83-304-41-105101

110-83-304-41-105101

CONN IC DIP SOCKET 4POS GOLD

Preci-Dip

0 -
RFQ
110-83-304-41-105101

데이터시트

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-87-304-41-007101

116-87-304-41-007101

CONN IC DIP SOCKET 4POS GOLD

Preci-Dip

0 -
RFQ
116-87-304-41-007101

데이터시트

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
AW 127-19/Z-T

AW 127-19/Z-T

SOCKET 19 CONTACTS SINGLE ROW

Assmann WSW Components

0 -
RFQ
AW 127-19/Z-T

데이터시트

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