IC 소켓

제조업체 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도

모두 초기화
모두 적용
결과
사진 제조사 부품 번호 재고 상태 가격 수량 데이터시트 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도
ICO-486-S8A-T

ICO-486-S8A-T

CONN IC DIP SOCKET 48POS TIN

3M

0 -
RFQ
ICO-486-S8A-T

데이터시트

ICO Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polyester, Glass Filled -65°C ~ 105°C
ICO-486-S8-T

ICO-486-S8-T

CONN IC DIP SOCKET 48POS TIN

3M

0 -
RFQ
ICO-486-S8-T

데이터시트

ICO Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polyester, Glass Filled -65°C ~ 105°C
AR08-HZL-TT

AR08-HZL-TT

CONN IC DIP SOCKET 8POS TIN

Assmann WSW Components

0 -
RFQ
AR08-HZL-TT

데이터시트

- Bag Obsolete DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
AW 127-04/Z-T

AW 127-04/Z-T

SOCKET 4 CONTACTS SINGLE ROW

Assmann WSW Components

0 -
RFQ
AW 127-04/Z-T

데이터시트

- - Active - - - - - - - - - - - - - - -
SIP1X05-011B

SIP1X05-011B

SIP1X05-011B-SIP SOCKET 5 CTS

Amphenol ICC (FCI)

0 -
RFQ
SIP1X05-011B

데이터시트

SIP1x Bulk Active SIP 5 (1 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
115-87-304-41-001101

115-87-304-41-001101

CONN IC DIP SOCKET 4POS GOLD

Preci-Dip

0 -
RFQ

-

115 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
AW 127-09/Z-T

AW 127-09/Z-T

SOCKET 9 CONTACTS SINGLE ROW

Assmann WSW Components

0 -
RFQ
AW 127-09/Z-T

데이터시트

- - Active - - - - - - - - - - - - - - -
DIP308-014B

DIP308-014B

DIP SOCKET 8 CTS

Amphenol ICC (FCI)

0 -
RFQ
DIP308-014B

데이터시트

- Bag Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
114-87-304-41-117101

114-87-304-41-117101

CONN IC DIP SOCKET 4POS GOLD

Preci-Dip

0 -
RFQ
114-87-304-41-117101

데이터시트

114 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
ICO-426-S8A-T

ICO-426-S8A-T

CONN IC DIP SOCKET 42POS TIN

3M

0 -
RFQ
ICO-426-S8A-T

데이터시트

ICO Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polyester, Glass Filled -65°C ~ 105°C
ICO-426-S8-T

ICO-426-S8-T

CONN IC DIP SOCKET 42POS TIN

3M

0 -
RFQ
ICO-426-S8-T

데이터시트

ICO Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polyester, Glass Filled -65°C ~ 105°C
AR 06 HGL-TT

AR 06 HGL-TT

SOCKET

Assmann WSW Components

0 -
RFQ
AR 06 HGL-TT

데이터시트

AR Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
DIP308-011B

DIP308-011B

DIP SOCKET 8 CTS

Amphenol ICC (FCI)

0 -
RFQ
DIP308-011B

데이터시트

- Bag Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
SIP1X06-014B

SIP1X06-014B

SIP1X06-014B-SIP SOCKET 6 CTS

Amphenol ICC (FCI)

0 -
RFQ
SIP1X06-014B

데이터시트

SIP1x Bulk Active SIP 6 (1 x 6) 0.100" (2.54mm) Tin-Lead 150.0µin (3.81µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
WMS-080Z

WMS-080Z

CONN IC DIP SOCKET 8POS GOLD

On Shore Technology Inc.

0 -
RFQ
WMS-080Z

데이터시트

WMS Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame, Wash Away Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass - -40°C ~ 105°C
DIP306-001B

DIP306-001B

SOCKET 6 CTS

Amphenol ICC (FCI)

0 -
RFQ
DIP306-001B

데이터시트

- Bag Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
01-0513-10

01-0513-10

CONN SOCKET SIP 1POS GOLD

Aries Electronics

0 -
RFQ
01-0513-10

데이터시트

0513 Bulk Active SIP 1 (1 x 1) - Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
01-0513-10T

01-0513-10T

CONN SOCKET SIP 1POS GOLD

Aries Electronics

0 -
RFQ
01-0513-10T

데이터시트

0513 Bulk Active SIP 1 (1 x 1) - Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
01-0518-10

01-0518-10

CONN SOCKET SIP 1POS GOLD

Aries Electronics

0 -
RFQ
01-0518-10

데이터시트

518 Bulk Active SIP 1 (1 x 1) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
SIP050-1X03-157B

SIP050-1X03-157B

1X03-157B-SIP SOCKET 3 CTS

Amphenol ICC (FCI)

0 -
RFQ
SIP050-1X03-157B

데이터시트

SIP050-1x Bulk Active SIP 3 (1 x 3) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
Total 19086 Record«Prev1... 7980818283848586...955Next»
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