IC 소켓

제조업체 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도

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결과
사진 제조사 부품 번호 재고 상태 가격 수량 데이터시트 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도
SA326040

SA326040

CONN IC DIP SOCKET 32POS GOLD

On Shore Technology Inc.

0 -
RFQ
SA326040

데이터시트

SA Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 80.0µin (2.03µm) Brass Thermoplastic, Polyester, Glass Filled -40°C ~ 105°C
PLCC-68-AT

PLCC-68-AT

PLCC 68P THROUGH HOLE

Adam Tech

0 -
RFQ
PLCC-68-AT

데이터시트

PLCC Tube Active PLCC 68 (4 x 17) 0.050" (1.27mm) Tin 80.0µin (2.03µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 80.0µin (2.03µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 105°C
SA406040

SA406040

CONN IC DIP SOCKET 40POS GOLD

On Shore Technology Inc.

0 -
RFQ
SA406040

데이터시트

SA Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 80.0µin (2.03µm) Brass Thermoplastic, Polyester, Glass Filled -40°C ~ 105°C
28-6518-10

28-6518-10

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

0 -
RFQ
28-6518-10

데이터시트

518 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
917-43-108-41-005000

917-43-108-41-005000

CONN TRANSIST TO-5 8POS GOLD

Mill-Max Manufacturing Corp.

0 -
RFQ
917-43-108-41-005000

데이터시트

917 Tube Active Transistor, TO-5 8 (Round) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder - Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
382

382

CONN IC DIP SOCKET 28POS

Adafruit Industries LLC

22 -
RFQ
382

데이터시트

- Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) - - - - - - - - - - - - -
28-3518-10

28-3518-10

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

4 -
RFQ
28-3518-10

데이터시트

518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
MIKROE-425

MIKROE-425

40 PIN ZIF SOCKET

MikroElektronika

8 -
RFQ
MIKROE-425

데이터시트

- Box Active DIP, ZIF (ZIP) 40 (2 x 20) - - - - Through Hole Closed Frame Solder - - - - - -
4732

4732

COVER PWR TRANS .210"ID TO-3

Keystone Electronics

3 -
RFQ
4732

데이터시트

- Bulk Active - - - - - - - - - - - - - - -
224-1286-00-0602J

224-1286-00-0602J

CONN IC DIP SOCKET ZIF 24POS GLD

3M

0 -
RFQ
224-1286-00-0602J

데이터시트

Textool™ Tube Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
224-5248-00-0602J

224-5248-00-0602J

CONN IC DIP SOCKET ZIF 24POS GLD

3M

0 -
RFQ
224-5248-00-0602J

데이터시트

Textool™ Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
214-7390-55-1902

214-7390-55-1902

CONN SOCKET SOIC 14POS GOLD

3M

1 -
RFQ
214-7390-55-1902

데이터시트

Textool™ Bulk Active SOIC 14 (2 x 7) - Gold - Beryllium Copper Through Hole Closed Frame Solder - Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES), Glass Filled -55°C ~ 150°C
228-1371-00-0602J

228-1371-00-0602J

CONN IC DIP SOCKET ZIF 28POS GLD

3M

3 -
RFQ
228-1371-00-0602J

데이터시트

Textool™ Tray Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
216-5205-01

216-5205-01

CONN SOCKET QFN 16POS GOLD

3M

0 -
RFQ
216-5205-01

데이터시트

Textool™ Bulk Active QFN 16 (3x3) 0.020" (0.50mm) Gold - Beryllium Copper Through Hole - Solder - Gold - Beryllium Copper Polyethersulfone (PES) -
228-5204-01

228-5204-01

CONN SOCKET QFN 28POS GOLD

3M

0 -
RFQ
228-5204-01

데이터시트

Textool™ Bulk Active QFN 28 (4 x 7) 0.020" (0.50mm) Gold - Beryllium Copper Through Hole - Solder - Gold - Beryllium Copper Polyethersulfone (PES) -
115-93-308-41-003000

115-93-308-41-003000

CONN IC DIP SOCKET 8POS GOLD

Mill-Max Manufacturing Corp.

0 -
RFQ
115-93-308-41-003000

데이터시트

115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
940-44-020-17-400000

940-44-020-17-400000

CONN SOCKET PLCC 20POS TIN

Mill-Max Manufacturing Corp.

0 -
RFQ
940-44-020-17-400000

데이터시트

940 Tube Active PLCC 20 (4 x 5) 0.050" (1.27mm) Tin 150.0µin (3.81µm) Beryllium Copper Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
214-99-316-01-670800

214-99-316-01-670800

CONN IC DIP SOCKET 16POS TINLEAD

Mill-Max Manufacturing Corp.

15 -
RFQ
214-99-316-01-670800

데이터시트

214 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
XR2A-1411-N

XR2A-1411-N

CONN IC DIP SOCKET 14POS GOLD

Omron Electronics Inc-EMC Div

0 -
RFQ
XR2A-1411-N

데이터시트

XR2 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 125°C
AR 16-HZW/TN

AR 16-HZW/TN

CONN IC DIP SOCKET 16POS GOLD

Assmann WSW Components

0 -
RFQ
AR 16-HZW/TN

데이터시트

- Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
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