IC 소켓

제조업체 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도

모두 초기화
모두 적용
결과
사진 제조사 부품 번호 재고 상태 가격 수량 데이터시트 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도
XR3G-6401

XR3G-6401

CONN IC SOCKET 64POS

Omron Electronics Inc-EMC Div

7 -
RFQ
XR3G-6401

데이터시트

- Box Active - - - - - - - - - - - - - - -
116-43-314-41-006000

116-43-314-41-006000

CONN IC DIP SOCKET 14POS GOLD

Mill-Max Manufacturing Corp.

21 -
RFQ
116-43-314-41-006000

데이터시트

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
111-93-210-41-001000

111-93-210-41-001000

CONN IC DIP SOCKET 10POS GOLD

Mill-Max Manufacturing Corp.

44 -
RFQ
111-93-210-41-001000

데이터시트

111 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
299-93-630-10-002000

299-93-630-10-002000

CONN IC DIP SOCKET 30POS GOLD

Mill-Max Manufacturing Corp.

49 -
RFQ
299-93-630-10-002000

데이터시트

299 Tube Active DIP, 0.6" (15.24mm) Row Spacing 30 (2 x 15) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-93-316-41-605000

110-93-316-41-605000

CONN IC DIP SOCKET 16POS GOLD

Mill-Max Manufacturing Corp.

31 -
RFQ
110-93-316-41-605000

데이터시트

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
111-41-428-41-001000

111-41-428-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

44 -
RFQ
111-41-428-41-001000

데이터시트

111 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-93-322-41-105000

110-93-322-41-105000

CONN IC DIP SOCKET 22POS GOLD

Mill-Max Manufacturing Corp.

40 -
RFQ
110-93-322-41-105000

데이터시트

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-13-420-41-001000

110-13-420-41-001000

CONN IC DIP SOCKET 20POS GOLD

Mill-Max Manufacturing Corp.

59 -
RFQ
110-13-420-41-001000

데이터시트

110 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-93-432-41-001000

110-93-432-41-001000

CONN IC DIP SOCKET 32POS GOLD

Mill-Max Manufacturing Corp.

36 -
RFQ
110-93-432-41-001000

데이터시트

110 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
ACA-SPI-006-K01

ACA-SPI-006-K01

SPI 16 PIN_IC 300mil

LOTES

40 -
RFQ
ACA-SPI-006-K01

데이터시트

- Tape & Reel (TR) Active SOIC 16 (2 x 8) 0.050" (1.27mm) Gold 1.00µin (0.025µm) Phosphor Bronze Surface Mount Board Guide, Closed Frame Solder 0.050" (1.27mm) Gold 1.00µin (0.025µm) Phosphor Bronze Liquid Crystal Polymer (LCP) -
614-43-624-31-012000

614-43-624-31-012000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.

23 -
RFQ
614-43-624-31-012000

데이터시트

614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
115-43-648-41-003000

115-43-648-41-003000

CONN IC DIP SOCKET 48POS GOLD

Mill-Max Manufacturing Corp.

21 -
RFQ
115-43-648-41-003000

데이터시트

115 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
714-93-132-31-018000

714-93-132-31-018000

CONN SOCKET SIP 32POS GOLD

Mill-Max Manufacturing Corp.

7 -
RFQ
714-93-132-31-018000

데이터시트

714 Tube Active SIP 32 (1 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
1554653-1

1554653-1

CONN SOCKET LGA 2011POS GOLD

TE Connectivity AMP Connectors

0 -
RFQ
1554653-1

데이터시트

- Tray Obsolete LGA 2011 (47 x 58) - Gold 15.0µin (0.38µm) Copper Alloy Surface Mount Open Frame Solder - Gold 15.0µin (0.38µm) Copper Alloy Thermoplastic -25°C ~ 100°C
299-93-318-11-001000

299-93-318-11-001000

CONN IC DIP SOCKET 18POS GOLD

Mill-Max Manufacturing Corp.

41 -
RFQ
299-93-318-11-001000

데이터시트

299 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
117-93-652-41-005000

117-93-652-41-005000

CONN IC DIP SOCKET 52POS GOLD

Mill-Max Manufacturing Corp.

18 -
RFQ
117-93-652-41-005000

데이터시트

117 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
123-93-624-41-801000

123-93-624-41-801000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.

24 -
RFQ
123-93-624-41-801000

데이터시트

123 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
299-93-614-10-002000

299-93-614-10-002000

CONN IC DIP SOCKET 14POS GOLD

Mill-Max Manufacturing Corp.

48 -
RFQ
299-93-614-10-002000

데이터시트

299 Tube Active DIP, 0.6" (15.24mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
299-93-616-10-002000

299-93-616-10-002000

CONN IC DIP SOCKET 16POS GOLD

Mill-Max Manufacturing Corp.

59 -
RFQ
299-93-616-10-002000

데이터시트

299 Tube Active DIP, 0.6" (15.24mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
123-43-628-41-801000

123-43-628-41-801000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.

79 -
RFQ
123-43-628-41-801000

데이터시트

123 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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