IC 소켓

제조업체 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도

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결과
사진 제조사 부품 번호 재고 상태 가격 수량 데이터시트 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도
3-1437508-9

3-1437508-9

CONN TRANSIST TO-5 8POS GOLD

TE Connectivity AMP Connectors

0 -
RFQ

-

8058 Bulk Obsolete Transistor, TO-5 8 (Round) - Gold - Beryllium Copper Through Hole Closed Frame Solder - Gold - Brass Polytetrafluoroethylene (PTFE) -55°C ~ 125°C
ICA-640-ZWTT

ICA-640-ZWTT

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
RFQ
ICA-640-ZWTT

데이터시트

ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
08-2503-31

08-2503-31

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

0 -
RFQ
08-2503-31

데이터시트

503 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
32-3513-10H

32-3513-10H

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

0 -
RFQ
32-3513-10H

데이터시트

Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
18-6511-11

18-6511-11

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

0 -
RFQ
18-6511-11

데이터시트

511 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
510-83-142-15-081101

510-83-142-15-081101

CONN SOCKET PGA 142POS GOLD

Preci-Dip

0 -
RFQ
510-83-142-15-081101

데이터시트

510 Bulk Active PGA 142 (15 x 15) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
714-43-125-31-018000

714-43-125-31-018000

CONN SOCKET SIP 25POS GOLD

Mill-Max Manufacturing Corp.

0 -
RFQ
714-43-125-31-018000

데이터시트

714 Bulk Active SIP 25 (1 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
PGA241H009B5-1849R

PGA241H009B5-1849R

PGA SOCKET 241 CTS

Amphenol ICC (FCI)

0 -
RFQ
PGA241H009B5-1849R

데이터시트

- - Active PGA 241 (18 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Open Frame - - - - - - -
APH-1510-T-T

APH-1510-T-T

APH-1510-T-T

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1010-T-T

APH-1010-T-T

APH-1010-T-T

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0710-T-T

APH-0710-T-T

APH-0710-T-T

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1810-T-T

APH-1810-T-T

APH-1810-T-T

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0310-T-T

APH-0310-T-T

APH-0310-T-T

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
HLS-0308-T-38

HLS-0308-T-38

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
RFQ
HLS-0308-T-38

데이터시트

HLS Tube Active SIP 24 (3 x 8) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
40-6518-112

40-6518-112

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

0 -
RFQ
40-6518-112

데이터시트

518 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
ICA-316-WGG-3

ICA-316-WGG-3

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
RFQ
ICA-316-WGG-3

데이터시트

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
HLS-0308-T-12

HLS-0308-T-12

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
RFQ
HLS-0308-T-12

데이터시트

HLS Tube Active SIP 24 (3 x 8) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
HLS-0120-G-22

HLS-0120-G-22

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
RFQ
HLS-0120-G-22

데이터시트

HLS Tube Active SIP 20 (1 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
ICO-624-MGG

ICO-624-MGG

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
RFQ
ICO-624-MGG

데이터시트

ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
12-6820-90C

12-6820-90C

CONN IC DIP SOCKET 12POS GOLD

Aries Electronics

0 -
RFQ
12-6820-90C

데이터시트

Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
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