IC 소켓

제조업체 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도

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결과
사진 제조사 부품 번호 재고 상태 가격 수량 데이터시트 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도
510-83-160-15-061101

510-83-160-15-061101

CONN SOCKET PGA 160POS GOLD

Preci-Dip

0 -
RFQ
510-83-160-15-061101

데이터시트

510 Bulk Active PGA 160 (15 x 15) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-83-160-13-001101

510-83-160-13-001101

CONN SOCKET PGA 160POS GOLD

Preci-Dip

0 -
RFQ
510-83-160-13-001101

데이터시트

510 Bulk Active PGA 160 (13 x 13) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-83-160-14-001101

510-83-160-14-001101

CONN SOCKET PGA 160POS GOLD

Preci-Dip

0 -
RFQ
510-83-160-14-001101

데이터시트

510 Bulk Active PGA 160 (14 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
HLS-0209-G-38

HLS-0209-G-38

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
RFQ
HLS-0209-G-38

데이터시트

HLS Tube Active SIP 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
510-83-160-16-081101

510-83-160-16-081101

CONN SOCKET PGA 160POS GOLD

Preci-Dip

0 -
RFQ
510-83-160-16-081101

데이터시트

510 Bulk Active PGA 160 (16 x 16) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
124-41-304-41-002000

124-41-304-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
RFQ
124-41-304-41-002000

데이터시트

124 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
124-91-304-41-002000

124-91-304-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
RFQ
124-91-304-41-002000

데이터시트

124 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
11-71000-10

11-71000-10

CONN SOCKET SIP 11POS TIN

Aries Electronics

0 -
RFQ
11-71000-10

데이터시트

700 Elevator Strip-Line™ Bulk Active SIP 11 (1 x 11) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
11-7400-10

11-7400-10

CONN SOCKET SIP 11POS TIN

Aries Electronics

0 -
RFQ
11-7400-10

데이터시트

700 Elevator Strip-Line™ Bulk Active SIP 11 (1 x 11) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
11-7587-10

11-7587-10

CONN SOCKET SIP 11POS TIN

Aries Electronics

0 -
RFQ
11-7587-10

데이터시트

700 Elevator Strip-Line™ Bulk Active SIP 11 (1 x 11) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
08-6621-30

08-6621-30

CONN IC DIP SOCKET 8POS TIN

Aries Electronics

0 -
RFQ
08-6621-30

데이터시트

6621 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Bottom Entry; Through Board Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
09-0501-30

09-0501-30

CONN SOCKET SIP 9POS TIN

Aries Electronics

0 -
RFQ
09-0501-30

데이터시트

501 Bulk Active SIP 9 (1 x 9) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
ICO-320-CGG

ICO-320-CGG

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
RFQ
ICO-320-CGG

데이터시트

ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
546-87-085-11-002135

546-87-085-11-002135

CONN SOCKET PGA 85POS GOLD

Preci-Dip

0 -
RFQ
546-87-085-11-002135

데이터시트

546 Bulk Active PGA 85 (11 x 11) 0.050" (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
30-9513-11

30-9513-11

CONN IC DIP SOCKET 30POS GOLD

Aries Electronics

0 -
RFQ
30-9513-11

데이터시트

Lo-PRO®file, 513 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 30 (2 x 15) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
13-0508-21

13-0508-21

CONN SOCKET SIP 13POS GOLD

Aries Electronics

0 -
RFQ
13-0508-21

데이터시트

508 Bulk Active SIP 13 (1 x 13) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
13-0508-31

13-0508-31

CONN SOCKET SIP 13POS GOLD

Aries Electronics

0 -
RFQ
13-0508-31

데이터시트

508 Bulk Active SIP 13 (1 x 13) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
18-3508-301

18-3508-301

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

0 -
RFQ
18-3508-301

데이터시트

508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
14-6823-90

14-6823-90

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

0 -
RFQ
14-6823-90

데이터시트

Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
550-80-069-11-001101

550-80-069-11-001101

PGA SOLDER TAIL

Preci-Dip

0 -
RFQ
550-80-069-11-001101

데이터시트

550 Bulk Active PGA 69 (11 x 11) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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