IC 소켓

제조업체 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도

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결과
사진 제조사 부품 번호 재고 상태 가격 수량 데이터시트 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도
20-0501-30

20-0501-30

CONN SOCKET SIP 20POS TIN

Aries Electronics

0 -
RFQ
20-0501-30

데이터시트

501 Bulk Active SIP 20 (1 x 20) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
20-0501-20

20-0501-20

CONN SOCKET SIP 20POS TIN

Aries Electronics

0 -
RFQ
20-0501-20

데이터시트

501 Bulk Active SIP 20 (1 x 20) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
510-87-257-19-081101

510-87-257-19-081101

CONN SOCKET PGA 257POS GOLD

Preci-Dip

0 -
RFQ
510-87-257-19-081101

데이터시트

510 Bulk Active PGA 257 (19 x 19) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-83-156-16-001101

510-83-156-16-001101

CONN SOCKET PGA 156POS GOLD

Preci-Dip

0 -
RFQ
510-83-156-16-001101

데이터시트

510 Bulk Active PGA 156 (16 x 16) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-83-156-16-091101

510-83-156-16-091101

CONN SOCKET PGA 156POS GOLD

Preci-Dip

0 -
RFQ
510-83-156-16-091101

데이터시트

510 Bulk Active PGA 156 (16 x 16) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
126-41-304-41-003000

126-41-304-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
RFQ
126-41-304-41-003000

데이터시트

126 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
126-91-304-41-003000

126-91-304-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
RFQ
126-91-304-41-003000

데이터시트

126 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
APH-1816-T-H

APH-1816-T-H

APH-1816-T-H

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1416-T-H

APH-1416-T-H

APH-1416-T-H

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1916-T-H

APH-1916-T-H

APH-1916-T-H

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0216-T-H

APH-0216-T-H

APH-0216-T-H

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0316-T-H

APH-0316-T-H

APH-0316-T-H

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0416-T-H

APH-0416-T-H

APH-0416-T-H

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1216-T-H

APH-1216-T-H

APH-1216-T-H

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1716-T-H

APH-1716-T-H

APH-1716-T-H

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0716-T-H

APH-0716-T-H

APH-0716-T-H

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
299-87-632-10-002101

299-87-632-10-002101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

0 -
RFQ
299-87-632-10-002101

데이터시트

299 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
124-83-652-41-002101

124-83-652-41-002101

CONN IC DIP SOCKET 52POS GOLD

Preci-Dip

0 -
RFQ

-

124 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
HLS-0119-G-10

HLS-0119-G-10

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
RFQ
HLS-0119-G-10

데이터시트

HLS Tube Active SIP 19 (1 x 19) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
116-93-304-41-001000

116-93-304-41-001000

CONN IC DIP SOCKET 4POS GOLD

Mill-Max Manufacturing Corp.

0 -
RFQ
116-93-304-41-001000

데이터시트

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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