IC 소켓

제조업체 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도

모두 초기화
모두 적용
결과
사진 제조사 부품 번호 재고 상태 가격 수량 데이터시트 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도
123-87-650-41-001101

123-87-650-41-001101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip

0 -
RFQ
123-87-650-41-001101

데이터시트

123 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
HLS-0310-TT-22

HLS-0310-TT-22

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
RFQ
HLS-0310-TT-22

데이터시트

HLS Tube Active SIP 30 (3 x 10) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - - Thermoplastic -55°C ~ 140°C
614-83-950-31-012101

614-83-950-31-012101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip

0 -
RFQ
614-83-950-31-012101

데이터시트

614 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
02-0511-11

02-0511-11

CONN SOCKET SIP 2POS GOLD

Aries Electronics

0 -
RFQ
02-0511-11

데이터시트

511 Bulk Active SIP 2 (1 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
06-2503-21

06-2503-21

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics

0 -
RFQ
06-2503-21

데이터시트

503 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
06-2503-31

06-2503-31

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics

0 -
RFQ
06-2503-31

데이터시트

503 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
12-6503-20

12-6503-20

CONN IC DIP SOCKET 12POS GOLD

Aries Electronics

0 -
RFQ
12-6503-20

데이터시트

503 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
12-6503-30

12-6503-30

CONN IC DIP SOCKET 12POS GOLD

Aries Electronics

0 -
RFQ
12-6503-30

데이터시트

503 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
16-0517-90C

16-0517-90C

CONN SOCKET SIP 16POS GOLD

Aries Electronics

0 -
RFQ
16-0517-90C

데이터시트

0517 Bulk Active SIP 16 (1 x 16) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle - Solder - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
146-83-640-41-035101

146-83-640-41-035101

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip

0 -
RFQ
146-83-640-41-035101

데이터시트

146 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
146-83-640-41-036101

146-83-640-41-036101

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip

0 -
RFQ
146-83-640-41-036101

데이터시트

146 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
PGA168H008B5-1706R

PGA168H008B5-1706R

PGA SOCKET 168 CTS

Amphenol ICC (FCI)

0 -
RFQ
PGA168H008B5-1706R

데이터시트

- - Active PGA 168 (17 x 17) 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Through Hole Open Frame - - - - - - -
124-83-432-41-002101

124-83-432-41-002101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

0 -
RFQ

-

124 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
HLS-0116-T-10

HLS-0116-T-10

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
RFQ
HLS-0116-T-10

데이터시트

HLS Tube Active SIP 16 (1 x 16) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
4594

4594

CONN SOCKET TRANSIST TO100 10POS

Keystone Electronics

0 -
RFQ
4594

데이터시트

- Bulk Active Transistor, TO-100 10 (Round) - Tin - Brass Chassis Mount Closed Frame Solder - Tin - Brass Polyester, Glass Filled -
116-83-648-41-006101

116-83-648-41-006101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip

0 -
RFQ
116-83-648-41-006101

데이터시트

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
13-0511-10

13-0511-10

CONN SOCKET SIP 13POS TIN

Aries Electronics

0 -
RFQ
13-0511-10

데이터시트

511 Bulk Active SIP 13 (1 x 13) 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole - Solder 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
510-87-159-16-071101

510-87-159-16-071101

CONN SOCKET PGA 159POS GOLD

Preci-Dip

0 -
RFQ
510-87-159-16-071101

데이터시트

510 Bulk Active PGA 159 (16 x 16) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-87-648-41-007101

116-87-648-41-007101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip

0 -
RFQ
116-87-648-41-007101

데이터시트

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
HLS-0112-G-2

HLS-0112-G-2

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
RFQ
HLS-0112-G-2

데이터시트

HLS Tube Active SIP 12 (1 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
Total 19086 Record«Prev1... 299300301302303304305306...955Next»
TomatoElec

검색

TomatoElec

제품

TomatoElec

전화번호

TomatoElec

사용자