IC 소켓

제조업체 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도

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결과
사진 제조사 부품 번호 재고 상태 가격 수량 데이터시트 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도
116-83-650-41-003101

116-83-650-41-003101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip

0 -
RFQ
116-83-650-41-003101

데이터시트

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
ICF-320-TL-O

ICF-320-TL-O

.100" SURFACE MOUNT SCREW MACHIN

Samtec Inc.

0 -
RFQ
ICF-320-TL-O

데이터시트

ICF Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
08-810-90T

08-810-90T

CONN IC DIP SOCKET 8POS TIN

Aries Electronics

0 -
RFQ
08-810-90T

데이터시트

Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Vertical Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
ICA-422-ATT

ICA-422-ATT

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
RFQ
ICA-422-ATT

데이터시트

ICA Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
ICO-422-ATT

ICO-422-ATT

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
RFQ
ICO-422-ATT

데이터시트

ICO Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
14-0511-10

14-0511-10

CONN SOCKET SIP 14POS TIN

Aries Electronics

0 -
RFQ
14-0511-10

데이터시트

511 Bulk Active SIP 14 (1 x 14) 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole - Solder 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
1825046-2

1825046-2

CONN IC DIP SOCKET 8POS TIN

TE Connectivity AMP Connectors

0 -
RFQ

-

800 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) - - Brass - -
15-0508-20

15-0508-20

CONN SOCKET SIP 15POS GOLD

Aries Electronics

0 -
RFQ
15-0508-20

데이터시트

508 Bulk Active SIP 15 (1 x 15) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
15-0508-30

15-0508-30

CONN SOCKET SIP 15POS GOLD

Aries Electronics

0 -
RFQ
15-0508-30

데이터시트

508 Bulk Active SIP 15 (1 x 15) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
510-87-169-13-000101

510-87-169-13-000101

CONN SOCKET PGA 169POS GOLD

Preci-Dip

0 -
RFQ
510-87-169-13-000101

데이터시트

510 Bulk Active PGA 169 (13 x 13) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-83-095-14-091101

510-83-095-14-091101

CONN SOCKET PGA 95POS GOLD

Preci-Dip

0 -
RFQ
510-83-095-14-091101

데이터시트

510 Bulk Active PGA 95 (14 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
ICA-624-SGT-L

ICA-624-SGT-L

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
RFQ
ICA-624-SGT-L

데이터시트

ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
ICO-624-SGT-L

ICO-624-SGT-L

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
RFQ
ICO-624-SGT-L

데이터시트

ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
116-87-650-41-008101

116-87-650-41-008101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip

0 -
RFQ
116-87-650-41-008101

데이터시트

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
117-83-448-41-105101

117-83-448-41-105101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip

0 -
RFQ
117-83-448-41-105101

데이터시트

117 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 48 (2 x 24) 0.070" (1.78mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
117-83-648-41-105101

117-83-648-41-105101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip

0 -
RFQ
117-83-648-41-105101

데이터시트

117 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.070" (1.78mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
ICO-320-ZSGT

ICO-320-ZSGT

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
RFQ
ICO-320-ZSGT

데이터시트

ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
116-83-320-41-013101

116-83-320-41-013101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

0 -
RFQ
116-83-320-41-013101

데이터시트

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-83-420-41-013101

116-83-420-41-013101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

0 -
RFQ
116-83-420-41-013101

데이터시트

116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
10-820-90C

10-820-90C

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

0 -
RFQ
10-820-90C

데이터시트

Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
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