IC 소켓

제조업체 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도

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결과
사진 제조사 부품 번호 재고 상태 가격 수량 데이터시트 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도
HLS-0304-G-11

HLS-0304-G-11

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
RFQ
HLS-0304-G-11

데이터시트

HLS Tube Active SIP 12 (3 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
HLS-0205-G-12

HLS-0205-G-12

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
RFQ
HLS-0205-G-12

데이터시트

HLS Tube Active SIP 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
HLS-0112-T-32

HLS-0112-T-32

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
RFQ
HLS-0112-T-32

데이터시트

HLS Tube Active SIP 12 (1 x 12) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
116-87-642-41-001101

116-87-642-41-001101

CONN IC DIP SOCKET 42POS GOLD

Preci-Dip

0 -
RFQ
116-87-642-41-001101

데이터시트

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
14-3503-20

14-3503-20

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

0 -
RFQ
14-3503-20

데이터시트

503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
14-3503-30

14-3503-30

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

0 -
RFQ
14-3503-30

데이터시트

503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
ICA-316-WGT

ICA-316-WGT

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
RFQ
ICA-316-WGT

데이터시트

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
ICO-316-ZAGT

ICO-316-ZAGT

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
RFQ
ICO-316-ZAGT

데이터시트

ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
124-83-428-41-002101

124-83-428-41-002101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

0 -
RFQ

-

124 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
ICA-308-ZWGG

ICA-308-ZWGG

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
RFQ
ICA-308-ZWGG

데이터시트

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
614-83-650-31-012101

614-83-650-31-012101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip

0 -
RFQ
614-83-650-31-012101

데이터시트

614 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-87-642-41-007101

116-87-642-41-007101

CONN IC DIP SOCKET 42POS GOLD

Preci-Dip

0 -
RFQ
116-87-642-41-007101

데이터시트

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
48-6513-10T

48-6513-10T

CONN IC DIP SOCKET 48POS GOLD

Aries Electronics

0 -
RFQ
48-6513-10T

데이터시트

Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
117-87-664-41-105101

117-87-664-41-105101

CONN IC DIP SOCKET 64POS GOLD

Preci-Dip

0 -
RFQ
117-87-664-41-105101

데이터시트

117 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 64 (2 x 32) 0.070" (1.78mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
24-6518-102

24-6518-102

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

0 -
RFQ
24-6518-102

데이터시트

518 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
510-87-155-16-003101

510-87-155-16-003101

CONN SOCKET PGA 155POS GOLD

Preci-Dip

0 -
RFQ
510-87-155-16-003101

데이터시트

510 Bulk Active PGA 155 (16 x 16) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-87-155-16-093101

510-87-155-16-093101

CONN SOCKET PGA 155POS GOLD

Preci-Dip

0 -
RFQ
510-87-155-16-093101

데이터시트

510 Bulk Active PGA 155 (16 x 16) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
299-83-616-10-002101

299-83-616-10-002101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

0 -
RFQ
299-83-616-10-002101

데이터시트

299 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
3-822516-6

3-822516-6

CONN SOCKET PLCC 84POS TIN

TE Connectivity AMP Connectors

0 -
RFQ
3-822516-6

데이터시트

- Tape & Reel (TR) Active PLCC 84 (4 x 21) 0.050" (1.27mm) Tin 100.0µin (2.54µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 100.0µin (2.54µm) Phosphor Bronze Thermoplastic -
HLS-0114-T-15

HLS-0114-T-15

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
RFQ
HLS-0114-T-15

데이터시트

HLS Tube Active SIP 14 (1 x 14) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
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