IC 소켓

제조업체 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도

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결과
사진 제조사 부품 번호 재고 상태 가격 수량 데이터시트 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도
116-87-424-41-004101

116-87-424-41-004101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

0 -
RFQ
116-87-424-41-004101

데이터시트

116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-83-628-41-007101

116-83-628-41-007101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

0 -
RFQ
116-83-628-41-007101

데이터시트

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
06-0508-21

06-0508-21

CONN SOCKET SIP 6POS GOLD

Aries Electronics

0 -
RFQ
06-0508-21

데이터시트

508 Bulk Active SIP 6 (1 x 6) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
06-0508-31

06-0508-31

CONN SOCKET SIP 6POS GOLD

Aries Electronics

0 -
RFQ
06-0508-31

데이터시트

508 Bulk Active SIP 6 (1 x 6) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
06-1508-21

06-1508-21

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics

0 -
RFQ
06-1508-21

데이터시트

508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
06-1508-31

06-1508-31

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics

0 -
RFQ
06-1508-31

데이터시트

508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
PLCC-044-T-A

PLCC-044-T-A

CONN SOCKET PLCC 44POS TIN

Samtec Inc.

0 -
RFQ
PLCC-044-T-A

데이터시트

PLCC Tube Obsolete PLCC 44 (4 x 11) 0.050" (1.27mm) Tin - Beryllium Copper Surface Mount Closed Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
28-3518-11

28-3518-11

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

0 -
RFQ
28-3518-11

데이터시트

518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
110-83-650-41-005101

110-83-650-41-005101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip

0 -
RFQ
110-83-650-41-005101

데이터시트

110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
ICO-624-MTT

ICO-624-MTT

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
RFQ
ICO-624-MTT

데이터시트

ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
ICO-308-ZCGT

ICO-308-ZCGT

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
RFQ
ICO-308-ZCGT

데이터시트

ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
21-0513-11

21-0513-11

CONN SOCKET SIP 21POS GOLD

Aries Electronics

0 -
RFQ
21-0513-11

데이터시트

0513 Bulk Active SIP 21 (1 x 21) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
24-0513-10H

24-0513-10H

CONN SOCKET SIP 24POS GOLD

Aries Electronics

0 -
RFQ
24-0513-10H

데이터시트

0513 Bulk Active SIP 24 (1 x 24) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
19-0518-11H

19-0518-11H

CONN SOCKET SIP 19POS GOLD

Aries Electronics

0 -
RFQ
19-0518-11H

데이터시트

518 Bulk Active SIP 19 (1 x 19) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
40-1518-10H

40-1518-10H

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

0 -
RFQ
40-1518-10H

데이터시트

518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
116-87-652-41-006101

116-87-652-41-006101

CONN IC DIP SOCKET 52POS GOLD

Preci-Dip

0 -
RFQ
116-87-652-41-006101

데이터시트

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
2134146-2

2134146-2

CONN SOCKET PGA 989POS GOLD

TE Connectivity AMP Connectors

0 -
RFQ
2134146-2

데이터시트

- Tape & Reel (TR) Obsolete PGA 989 (35 x 36) 0.157" (4.00mm) Gold Flash Copper Alloy Surface Mount Open Frame Solder 0.157" (4.00mm) Tin-Lead Flash Copper Alloy Thermoplastic -
10-6513-10H

10-6513-10H

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

0 -
RFQ
10-6513-10H

데이터시트

Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
17-0518-00

17-0518-00

CONN SOCKET SIP 17POS GOLD

Aries Electronics

0 -
RFQ
17-0518-00

데이터시트

518 Bulk Active SIP 17 (1 x 17) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
32-1518-10T

32-1518-10T

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

0 -
RFQ
32-1518-10T

데이터시트

518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
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