IC 소켓

제조업체 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도

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결과
사진 제조사 부품 번호 재고 상태 가격 수량 데이터시트 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도
116-87-650-41-006101

116-87-650-41-006101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip

0 -
RFQ
116-87-650-41-006101

데이터시트

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-83-064-08-000101

510-83-064-08-000101

CONN SOCKET PGA 64POS GOLD

Preci-Dip

0 -
RFQ
510-83-064-08-000101

데이터시트

510 Bulk Active PGA 64 (8 x 8) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-83-064-10-001101

510-83-064-10-001101

CONN SOCKET PGA 64POS GOLD

Preci-Dip

0 -
RFQ
510-83-064-10-001101

데이터시트

510 Bulk Active PGA 64 (10 x 10) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-83-064-10-051101

510-83-064-10-051101

CONN SOCKET PGA 64POS GOLD

Preci-Dip

0 -
RFQ
510-83-064-10-051101

데이터시트

510 Bulk Active PGA 64 (10 x 10) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-83-432-41-006101

116-83-432-41-006101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

0 -
RFQ
116-83-432-41-006101

데이터시트

116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
ICO-320-NTT

ICO-320-NTT

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
RFQ
ICO-320-NTT

데이터시트

ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
HLS-0204-G-11

HLS-0204-G-11

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
RFQ
HLS-0204-G-11

데이터시트

HLS Tube Active SIP 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
110-83-628-41-801101

110-83-628-41-801101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

0 -
RFQ
110-83-628-41-801101

데이터시트

110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
HLS-0204-T-12

HLS-0204-T-12

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
RFQ
HLS-0204-T-12

데이터시트

HLS Tube Active SIP 8 (2 x 4) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
116-87-640-41-012101

116-87-640-41-012101

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip

0 -
RFQ
116-87-640-41-012101

데이터시트

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
ICA-314-ATT

ICA-314-ATT

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
RFQ
ICA-314-ATT

데이터시트

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
ICO-314-ATT

ICO-314-ATT

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
RFQ
ICO-314-ATT

데이터시트

ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
08-823-90T

08-823-90T

CONN IC DIP SOCKET 8POS TIN

Aries Electronics

0 -
RFQ
08-823-90T

데이터시트

Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
7-1437531-8

7-1437531-8

CONN IC DIP SOCKET 20POS GOLD

TE Connectivity AMP Connectors

0 -
RFQ
7-1437531-8

데이터시트

500 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold - Copper Alloy Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Copper Alloy - -55°C ~ 125°C
ICA-318-SST-L

ICA-318-SST-L

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
RFQ
ICA-318-SST-L

데이터시트

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 125°C
HLS-0109-T-10

HLS-0109-T-10

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
RFQ
HLS-0109-T-10

데이터시트

HLS Tube Active SIP 9 (1 x 9) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
HLS-0210-TT-10

HLS-0210-TT-10

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
RFQ
HLS-0210-TT-10

데이터시트

HLS Tube Active SIP 20 (2 x 10) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - - Thermoplastic -55°C ~ 140°C
32-6513-10T

32-6513-10T

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

0 -
RFQ
32-6513-10T

데이터시트

Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
28-3513-10

28-3513-10

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

0 -
RFQ
28-3513-10

데이터시트

Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
06-0503-21

06-0503-21

CONN SOCKET SIP 6POS GOLD

Aries Electronics

0 -
RFQ
06-0503-21

데이터시트

0503 Bulk Active SIP 6 (1 x 6) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled -
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