IC 소켓

제조업체 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도

모두 초기화
모두 적용
결과
사진 제조사 부품 번호 재고 상태 가격 수량 데이터시트 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도
124-83-422-41-002101

124-83-422-41-002101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

0 -
RFQ

-

124 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
28-6511-10

28-6511-10

CONN IC DIP SOCKET 28POS TIN

Aries Electronics

0 -
RFQ
28-6511-10

데이터시트

511 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
08-6501-20

08-6501-20

CONN IC DIP SOCKET 8POS TIN

Aries Electronics

0 -
RFQ
08-6501-20

데이터시트

501 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
08-6501-30

08-6501-30

CONN IC DIP SOCKET 8POS TIN

Aries Electronics

0 -
RFQ
08-6501-30

데이터시트

501 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
299-87-318-11-001101

299-87-318-11-001101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip

0 -
RFQ
299-87-318-11-001101

데이터시트

299 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
114-83-642-41-134161

114-83-642-41-134161

CONN IC DIP SOCKET 42POS GOLD

Preci-Dip

0 -
RFQ
114-83-642-41-134161

데이터시트

114 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
214-44-316-01-670799

214-44-316-01-670799

STANDRD SOLDER TAIL DIP SOCKET

Mill-Max Manufacturing Corp.

0 -
RFQ

-

214 Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
214-99-316-01-670799

214-99-316-01-670799

STANDRD SOLDER TAIL DIP SOCKET

Mill-Max Manufacturing Corp.

0 -
RFQ

-

214 Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
22-6511-10

22-6511-10

CONN IC DIP SOCKET 22POS TIN

Aries Electronics

0 -
RFQ
22-6511-10

데이터시트

511 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
32-0518-11

32-0518-11

CONN SOCKET SIP 32POS GOLD

Aries Electronics

0 -
RFQ
32-0518-11

데이터시트

518 Bulk Active SIP 32 (1 x 32) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
08-820-90T

08-820-90T

CONN IC DIP SOCKET 8POS TIN

Aries Electronics

0 -
RFQ
08-820-90T

데이터시트

Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
1571541-4

1571541-4

CONN SOCKET PLCC 84POS TIN

TE Connectivity AMP Connectors

0 -
RFQ
1571541-4

데이터시트

PCS Bulk Obsolete PLCC 84 (4 x 21) 0.100" (2.54mm) Tin 180.0µin (4.57µm) Copper Alloy Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 180.0µin (4.57µm) Copper Alloy Polyphenylene Sulfide (PPS) -
146-87-632-41-035101

146-87-632-41-035101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

0 -
RFQ
146-87-632-41-035101

데이터시트

146 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
ICO-628-STT-L

ICO-628-STT-L

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
RFQ
ICO-628-STT-L

데이터시트

ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
32-3513-10T

32-3513-10T

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

0 -
RFQ
32-3513-10T

데이터시트

Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
ICO-318-SST

ICO-318-SST

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
RFQ
ICO-318-SST

데이터시트

ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 125°C
840-AG11D-ES

840-AG11D-ES

CONN IC DIP SOCKET 40POS GOLD

TE Connectivity AMP Connectors

0 -
RFQ
840-AG11D-ES

데이터시트

800 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 5.00µin (0.127µm) Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead - Copper Alloy Polyester -55°C ~ 105°C
614-83-640-41-001101

614-83-640-41-001101

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip

0 -
RFQ
614-83-640-41-001101

데이터시트

614 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
29-0518-10H

29-0518-10H

CONN SOCKET SIP 29POS GOLD

Aries Electronics

0 -
RFQ
29-0518-10H

데이터시트

518 Bulk Active SIP 29 (1 x 29) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
116-87-324-41-004101

116-87-324-41-004101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

0 -
RFQ
116-87-324-41-004101

데이터시트

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
Total 19086 Record«Prev1... 244245246247248249250251...955Next»
TomatoElec

검색

TomatoElec

제품

TomatoElec

전화번호

TomatoElec

사용자