IC 소켓

제조업체 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도

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결과
사진 제조사 부품 번호 재고 상태 가격 수량 데이터시트 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도
27-0518-10T

27-0518-10T

CONN SOCKET SIP 27POS GOLD

Aries Electronics

0 -
RFQ
27-0518-10T

데이터시트

518 Bulk Active SIP 27 (1 x 27) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
116-87-628-41-009101

116-87-628-41-009101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

0 -
RFQ
116-87-628-41-009101

데이터시트

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
18-0513-11H

18-0513-11H

CONN SOCKET SIP 18POS GOLD

Aries Electronics

0 -
RFQ
18-0513-11H

데이터시트

0513 Bulk Active SIP 18 (1 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
24-4518-00

24-4518-00

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

0 -
RFQ
24-4518-00

데이터시트

518 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
16-C195-10

16-C195-10

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

0 -
RFQ
16-C195-10

데이터시트

EJECT-A-DIP™ Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
ICA-316-WTT-2

ICA-316-WTT-2

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
RFQ
ICA-316-WTT-2

데이터시트

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
ICF-322-T-O

ICF-322-T-O

.100" SURFACE MOUNT SCREW MACHIN

Samtec Inc.

0 -
RFQ
ICF-322-T-O

데이터시트

ICF Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
ICF-322-T-I

ICF-322-T-I

.100" SURFACE MOUNT SCREW MACHIN

Samtec Inc.

0 -
RFQ
ICF-322-T-I

데이터시트

ICF Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
510-87-097-11-041101

510-87-097-11-041101

CONN SOCKET PGA 97POS GOLD

Preci-Dip

0 -
RFQ
510-87-097-11-041101

데이터시트

510 Bulk Active PGA 97 (11 x 11) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-87-314-41-013101

116-87-314-41-013101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip

0 -
RFQ
116-87-314-41-013101

데이터시트

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
115-83-642-41-001101

115-83-642-41-001101

CONN IC DIP SOCKET 42POS GOLD

Preci-Dip

0 -
RFQ

-

115 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
HLS-0303-T-10

HLS-0303-T-10

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
RFQ
HLS-0303-T-10

데이터시트

HLS Tube Active SIP 9 (3 x 3) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
ICF-316-SM-O-TR

ICF-316-SM-O-TR

.100" SURFACE MOUNT SCREW MACHIN

Samtec Inc.

0 -
RFQ
ICF-316-SM-O-TR

데이터시트

ICF Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
ICF-316-S-I-TR

ICF-316-S-I-TR

.100" SURFACE MOUNT SCREW MACHIN

Samtec Inc.

0 -
RFQ
ICF-316-S-I-TR

데이터시트

ICF Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
34-0518-10H

34-0518-10H

CONN SOCKET SIP 34POS GOLD

Aries Electronics

0 -
RFQ
34-0518-10H

데이터시트

518 Bulk Active SIP 34 (1 x 34) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
HLS-0109-T-30

HLS-0109-T-30

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
RFQ
HLS-0109-T-30

데이터시트

HLS Tube Active SIP 9 (1 x 9) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
ICF-324-T-I-TR

ICF-324-T-I-TR

.100" SURFACE MOUNT SCREW MACHIN

Samtec Inc.

0 -
RFQ
ICF-324-T-I-TR

데이터시트

ICF Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
HLS-0107-G-10

HLS-0107-G-10

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
RFQ
HLS-0107-G-10

데이터시트

HLS Tube Active SIP 7 (1 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
516-AG11D

516-AG11D

CONN IC DIP SOCKET 16POS GOLD

TE Connectivity AMP Connectors

0 -
RFQ
516-AG11D

데이터시트

500 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead - Copper Alloy Polyester -55°C ~ 105°C
18-3513-11

18-3513-11

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

0 -
RFQ
18-3513-11

데이터시트

Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
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