IC 소켓

제조업체 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도

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결과
사진 제조사 부품 번호 재고 상태 가격 수량 데이터시트 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도
ICO-316-ZSST

ICO-316-ZSST

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
RFQ
ICO-316-ZSST

데이터시트

ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 125°C
ICA-316-ZSST

ICA-316-ZSST

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
RFQ
ICA-316-ZSST

데이터시트

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 125°C
116-83-322-41-009101

116-83-322-41-009101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

0 -
RFQ
116-83-322-41-009101

데이터시트

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
36-1518-10T

36-1518-10T

CONN IC DIP SOCKET 36POS GOLD

Aries Electronics

0 -
RFQ
36-1518-10T

데이터시트

518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
39-0518-10

39-0518-10

CONN SOCKET SIP 39POS GOLD

Aries Electronics

0 -
RFQ
39-0518-10

데이터시트

518 Bulk Active SIP 39 (1 x 39) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
532-AG11D-ES

532-AG11D-ES

CONN IC DIP SOCKET 32POS GOLD

TE Connectivity AMP Connectors

0 -
RFQ
532-AG11D-ES

데이터시트

500 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) - - Brass - -55°C ~ 125°C
APA-308-G-J

APA-308-G-J

ADAPTER PLUG

Samtec Inc.

0 -
RFQ
APA-308-G-J

데이터시트

APA Tube Active - 8 (2 x 4) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
614-87-636-31-012101

614-87-636-31-012101

CONN IC DIP SOCKET 36POS GOLD

Preci-Dip

0 -
RFQ
614-87-636-31-012101

데이터시트

614 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
HLS-0107-G-22

HLS-0107-G-22

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
RFQ
HLS-0107-G-22

데이터시트

HLS Tube Active SIP 7 (1 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
ICF-324-STL-O-TR

ICF-324-STL-O-TR

.100" SURFACE MOUNT SCREW MACHIN

Samtec Inc.

0 -
RFQ
ICF-324-STL-O-TR

데이터시트

ICF Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
ICF-624-STL-O-TR

ICF-624-STL-O-TR

.100" SURFACE MOUNT SCREW MACHIN

Samtec Inc.

0 -
RFQ
ICF-624-STL-O-TR

데이터시트

ICF Tape & Reel (TR) Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
ICF-624-TL-O-TR

ICF-624-TL-O-TR

.100" SURFACE MOUNT SCREW MACHIN

Samtec Inc.

0 -
RFQ
ICF-624-TL-O-TR

데이터시트

ICF Tape & Reel (TR) Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
ICF-324-TL-O-TR

ICF-324-TL-O-TR

.100" SURFACE MOUNT SCREW MACHIN

Samtec Inc.

0 -
RFQ
ICF-324-TL-O-TR

데이터시트

ICF Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
19-0518-00

19-0518-00

CONN SOCKET SIP 19POS GOLD

Aries Electronics

0 -
RFQ
19-0518-00

데이터시트

518 Bulk Active SIP 19 (1 x 19) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
33-0518-10H

33-0518-10H

CONN SOCKET SIP 33POS GOLD

Aries Electronics

0 -
RFQ
33-0518-10H

데이터시트

518 Bulk Active SIP 33 (1 x 33) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
36-0518-10T

36-0518-10T

CONN SOCKET SIP 36POS GOLD

Aries Electronics

0 -
RFQ
36-0518-10T

데이터시트

518 Bulk Active SIP 36 (1 x 36) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
117-83-642-41-005101

117-83-642-41-005101

CONN IC DIP SOCKET 42POS GOLD

Preci-Dip

0 -
RFQ
117-83-642-41-005101

데이터시트

117 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.070" (1.78mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
818-AG12D

818-AG12D

CONN IC DIP SOCKET 18POS TINLEAD

TE Connectivity AMP Connectors

0 -
RFQ
818-AG12D

데이터시트

800 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Tin-Lead 80.0µin (2.03µm) Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) - - - Polyester -55°C ~ 105°C
1-1814655-7

1-1814655-7

CONN SOCKET SIP 28POS GOLD

TE Connectivity AMP Connectors

0 -
RFQ
1-1814655-7

데이터시트

- Bulk Obsolete SIP 28 (1 x 28) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 29.5µin (0.75µm) Brass Thermoplastic, Polyester -55°C ~ 125°C
614-87-642-41-001101

614-87-642-41-001101

CONN IC DIP SOCKET 42POS GOLD

Preci-Dip

0 -
RFQ
614-87-642-41-001101

데이터시트

614 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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