IC 소켓

제조업체 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도

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결과
사진 제조사 부품 번호 재고 상태 가격 수량 데이터시트 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도
116-83-422-41-009101

116-83-422-41-009101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

0 -
RFQ
116-83-422-41-009101

데이터시트

116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-87-628-41-007101

116-87-628-41-007101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

0 -
RFQ
116-87-628-41-007101

데이터시트

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
146-87-428-41-036101

146-87-428-41-036101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

0 -
RFQ
146-87-428-41-036101

데이터시트

146 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
ICA-314-ZWTT-3

ICA-314-ZWTT-3

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
RFQ
ICA-314-ZWTT-3

데이터시트

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
10-9513-10T

10-9513-10T

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

0 -
RFQ
10-9513-10T

데이터시트

Lo-PRO®file, 513 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
C8122-04

C8122-04

CONN IC DIP SOCKET 22POS TIN

Aries Electronics

0 -
RFQ
C8122-04

데이터시트

Edge-Grip™, C81 Bulk Obsolete DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
34-3513-10

34-3513-10

CONN IC DIP SOCKET 34POS GOLD

Aries Electronics

0 -
RFQ
34-3513-10

데이터시트

Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 34 (2 x 17) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
20-0513-10H

20-0513-10H

CONN SOCKET SIP 20POS GOLD

Aries Electronics

0 -
RFQ
20-0513-10H

데이터시트

0513 Bulk Active SIP 20 (1 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
24-3518-00

24-3518-00

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

0 -
RFQ
24-3518-00

데이터시트

518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
116-87-432-41-007101

116-87-432-41-007101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

0 -
RFQ
116-87-432-41-007101

데이터시트

116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-87-085-10-031101

510-87-085-10-031101

CONN SOCKET PGA 85POS GOLD

Preci-Dip

0 -
RFQ
510-87-085-10-031101

데이터시트

510 Bulk Active PGA 85 (10 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
40-1518-10

40-1518-10

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

0 -
RFQ
40-1518-10

데이터시트

518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
APA-308-T-P

APA-308-T-P

ADAPTER PLUG

Samtec Inc.

0 -
RFQ
APA-308-T-P

데이터시트

APA Tube Active - 8 (2 x 4) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
ICA-314-ZWTT-2

ICA-314-ZWTT-2

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
RFQ
ICA-314-ZWTT-2

데이터시트

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
AR 48-HZL/07-TT

AR 48-HZL/07-TT

CONN IC DIP SOCKET 48POS GOLD

Assmann WSW Components

0 -
RFQ
AR 48-HZL/07-TT

데이터시트

- Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
110-83-642-41-005101

110-83-642-41-005101

CONN IC DIP SOCKET 42POS GOLD

Preci-Dip

0 -
RFQ
110-83-642-41-005101

데이터시트

110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
28-6513-10

28-6513-10

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

0 -
RFQ
28-6513-10

데이터시트

Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
116-83-428-41-006101

116-83-428-41-006101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

0 -
RFQ
116-83-428-41-006101

데이터시트

116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
08-2513-11H

08-2513-11H

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

0 -
RFQ
08-2513-11H

데이터시트

Lo-PRO®file, 513 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
29-0518-10

29-0518-10

CONN SOCKET SIP 29POS GOLD

Aries Electronics

0 -
RFQ
29-0518-10

데이터시트

518 Bulk Active SIP 29 (1 x 29) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
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