IC 소켓

제조업체 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도

모두 초기화
모두 적용
결과
사진 제조사 부품 번호 재고 상태 가격 수량 데이터시트 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도
06-1518-10H

06-1518-10H

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics

0 -
RFQ
06-1518-10H

데이터시트

518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
02-0517-90C

02-0517-90C

CONN SOCKET SIP 2POS GOLD

Aries Electronics

0 -
RFQ
02-0517-90C

데이터시트

0517 Bulk Active SIP 2 (1 x 2) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle - Solder - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
HLS-0102-T-10

HLS-0102-T-10

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
RFQ
HLS-0102-T-10

데이터시트

HLS Tube Active SIP 2 (1 x 2) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
DIP624-011B

DIP624-011B

DIP624-011B-DIP SOCKET 24 CTS

Amphenol ICC (FCI)

0 -
RFQ
DIP624-011B

데이터시트

- Bag Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
130-028-000

130-028-000

CONN IC DIP SOCKET 28POS GOLD

3M

0 -
RFQ

-

100 Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled -65°C ~ 125°C
110-87-310-41-105161

110-87-310-41-105161

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0 -
RFQ
110-87-310-41-105161

데이터시트

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
AJ 42-LC

AJ 42-LC

SOCKET

Assmann WSW Components

0 -
RFQ

-

- Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.070" (1.78mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Open Frame Solder 0.070" (1.78mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT) -55°C ~ 85°C
116-87-310-41-006101

116-87-310-41-006101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0 -
RFQ
116-87-310-41-006101

데이터시트

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
114-83-306-41-134191

114-83-306-41-134191

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip

0 -
RFQ
114-83-306-41-134191

데이터시트

114 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
WMS-2810Z

WMS-2810Z

CONN IC DIP SOCKET 28POS GOLD

On Shore Technology Inc.

0 -
RFQ
WMS-2810Z

데이터시트

WMS Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame, Wash Away Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass - -40°C ~ 105°C
AR 10-HZL/07-TT

AR 10-HZL/07-TT

IC SOCKET 10 PIN MACH CONT

Assmann WSW Components

0 -
RFQ
AR 10-HZL/07-TT

데이터시트

- Tube Active - - - - - - - - - - - - - - -
A-CCS32-G

A-CCS32-G

CONN SOCKET PLCC 32POS GOLD

Assmann WSW Components

0 -
RFQ
A-CCS32-G

데이터시트

- Bag Obsolete PLCC 32 (2 x 7, 2 x 9) 0.050" (1.27mm) Gold - Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 105°C
612-87-610-41-001101

612-87-610-41-001101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0 -
RFQ
612-87-610-41-001101

데이터시트

612 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
05-0518-11

05-0518-11

CONN SOCKET SIP 5POS GOLD

Aries Electronics

0 -
RFQ
05-0518-11

데이터시트

518 Bulk Active SIP 5 (1 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
AW 127-37/Z-T

AW 127-37/Z-T

SOCKET 37 CONTACTS SINGLE ROW

Assmann WSW Components

0 -
RFQ
AW 127-37/Z-T

데이터시트

- - Active - - - - - - - - - - - - - - -
A-CCS52-Z-SM-R

A-CCS52-Z-SM-R

CONN SOCKET PLCC 52POS TIN

Assmann WSW Components

0 -
RFQ
A-CCS52-Z-SM-R

데이터시트

- Tube Obsolete PLCC 52 (4 x 13) 0.050" (1.27mm) Tin 150.0µin (3.81µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 150.0µin (3.81µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 105°C
116-87-308-41-012101

116-87-308-41-012101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip

0 -
RFQ
116-87-308-41-012101

데이터시트

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
AR 22-HGL/7-TT

AR 22-HGL/7-TT

SOCKET

Assmann WSW Components

0 -
RFQ

-

AR Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold Flash Brass Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
HLS-0102-T-11

HLS-0102-T-11

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
RFQ
HLS-0102-T-11

데이터시트

HLS Tube Active SIP 2 (1 x 2) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
510-83-012-05-001101

510-83-012-05-001101

CONN SOCKET PGA 12POS GOLD

Preci-Dip

0 -
RFQ
510-83-012-05-001101

데이터시트

510 Bulk Active PGA 12 (5 x 5) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
Total 19086 Record«Prev1... 101102103104105106107108...955Next»
TomatoElec

검색

TomatoElec

제품

TomatoElec

전화번호

TomatoElec

사용자