IC 소켓

제조업체 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도

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결과
사진 제조사 부품 번호 재고 상태 가격 수량 데이터시트 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도
940-99-068-17-400000

940-99-068-17-400000

CONN SOCKET PLCC 68POS TIN-LEAD

Mill-Max Manufacturing Corp.

0 -
RFQ
940-99-068-17-400000

데이터시트

940 Tube Obsolete PLCC 68 (4 x 17) 0.050" (1.27mm) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
WMS-240Z

WMS-240Z

CONN IC DIP SOCKET 24POS GOLD

On Shore Technology Inc.

0 -
RFQ
WMS-240Z

데이터시트

WMS Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame, Wash Away Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass - -40°C ~ 105°C
WMS-2410Z

WMS-2410Z

CONN IC DIP SOCKET 24POS GOLD

On Shore Technology Inc.

0 -
RFQ
WMS-2410Z

데이터시트

WMS Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame, Wash Away Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass - -40°C ~ 105°C
DIP324-014B

DIP324-014B

DIP324-014B-DIP SOCKET 24 CTS

Amphenol ICC (FCI)

0 -
RFQ
DIP324-014B

데이터시트

- Bag Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
1814655-1

1814655-1

CONN SOCKET SIP 4POS GOLD

TE Connectivity AMP Connectors

0 -
RFQ
1814655-1

데이터시트

- Bulk Obsolete SIP 4 (1 x 4) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 29.5µin (0.75µm) Brass Thermoplastic, Polyester -55°C ~ 125°C
SIP1X15-011B

SIP1X15-011B

SIP1X15-011B-SIP SOCKET 15 CTS

Amphenol ICC (FCI)

0 -
RFQ
SIP1X15-011B

데이터시트

SIP1x Bulk Active SIP 15 (1 x 15) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
116-87-306-41-002101

116-87-306-41-002101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip

0 -
RFQ
116-87-306-41-002101

데이터시트

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
AR 24 HZL/7-TT

AR 24 HZL/7-TT

SOCKET

Assmann WSW Components

0 -
RFQ

-

AR Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
SIP1X13-001B

SIP1X13-001B

SIP1X13-001B-SIP SOCKET 13 CTS

Amphenol ICC (FCI)

0 -
RFQ
SIP1X13-001B

데이터시트

SIP1x Bulk Active SIP 13 (1 x 13) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
HLS-0103-TT-11

HLS-0103-TT-11

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
RFQ
HLS-0103-TT-11

데이터시트

HLS Tube Active SIP 3 (1 x 3) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - - Thermoplastic -55°C ~ 140°C
110-87-210-01-742101

110-87-210-01-742101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0 -
RFQ
110-87-210-01-742101

데이터시트

110 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5), 6 Loaded 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
A16-LCG-T-R

A16-LCG-T-R

CONN IC DIP SOCKET 16POS GOLD

Assmann WSW Components

0 -
RFQ
A16-LCG-T-R

데이터시트

- Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold - - Through Hole Open Frame Solder 0.100" (2.54mm) Gold - - Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 105°C
A-CCS84-Z

A-CCS84-Z

CONN SOCKET PLCC 84POS TIN

Assmann WSW Components

0 -
RFQ
A-CCS84-Z

데이터시트

- Bag Obsolete PLCC 84 (4 x 21) 0.050" (1.27mm) Tin 150.0µin (3.81µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 150.0µin (3.81µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 105°C
114-83-308-41-134161

114-83-308-41-134161

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip

0 -
RFQ
114-83-308-41-134161

데이터시트

114 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-83-306-41-018101

116-83-306-41-018101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip

0 -
RFQ
116-83-306-41-018101

데이터시트

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
AR 42-HZL-TT

AR 42-HZL-TT

SOCKET

Assmann WSW Components

0 -
RFQ

-

AR Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
116-87-308-41-003101

116-87-308-41-003101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip

0 -
RFQ
116-87-308-41-003101

데이터시트

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
940-99-052-17-400000

940-99-052-17-400000

CONN SOCKET PLCC 52POS TIN-LEAD

Mill-Max Manufacturing Corp.

0 -
RFQ
940-99-052-17-400000

데이터시트

940 Tube Obsolete PLCC 52 (4 x 13) 0.050" (1.27mm) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
122-87-306-41-001101

122-87-306-41-001101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip

0 -
RFQ
122-87-306-41-001101

데이터시트

122 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-83-304-41-009101

116-83-304-41-009101

CONN IC DIP SOCKET 4POS GOLD

Preci-Dip

0 -
RFQ
116-83-304-41-009101

데이터시트

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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