IC 소켓

제조업체 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도

모두 초기화
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결과
사진 제조사 부품 번호 재고 상태 가격 수량 데이터시트 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도
WMS-280Z

WMS-280Z

CONN IC DIP SOCKET 28POS GOLD

On Shore Technology Inc.

0 -
RFQ
WMS-280Z

데이터시트

WMS Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame, Wash Away Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass - -40°C ~ 105°C
AR06-HZW/T-R

AR06-HZW/T-R

CONN IC DIP SOCKET 6POS TIN

Assmann WSW Components

0 -
RFQ
AR06-HZW/T-R

데이터시트

- Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester, Glass Filled -40°C ~ 105°C
AR 20 HGL-TT

AR 20 HGL-TT

SOCKET

Assmann WSW Components

0 -
RFQ

-

AR Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
HLS-0103-TT-12

HLS-0103-TT-12

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
RFQ
HLS-0103-TT-12

데이터시트

HLS Tube Active SIP 3 (1 x 3) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - - Thermoplastic -55°C ~ 140°C
110-83-210-41-001101

110-83-210-41-001101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0 -
RFQ
110-83-210-41-001101

데이터시트

110 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
110-87-310-41-105101

110-87-310-41-105101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0 -
RFQ
110-87-310-41-105101

데이터시트

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
DIP328-014B

DIP328-014B

DIP328-014B-DIP SOCKET 28 CTS

Amphenol ICC (FCI)

0 -
RFQ
DIP328-014B

데이터시트

- Bag Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
AR28-HZL/7/07-TT

AR28-HZL/7/07-TT

CONN IC DIP SOCKET 28POS GOLD

Assmann WSW Components

0 -
RFQ
AR28-HZL/7/07-TT

데이터시트

- Bag Obsolete DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
01-0503-31

01-0503-31

CONN SOCKET SIP 1POS GOLD

Aries Electronics

0 -
RFQ
01-0503-31

데이터시트

0503 Bulk Active SIP 1 (1 x 1) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap - Gold 30.0µin (0.76µm) Brass Polyamide (PA), Nylon, Glass Filled -
110-87-320-41-001151

110-87-320-41-001151

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

0 -
RFQ

-

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame, No Center Bar Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-87-306-41-001101

116-87-306-41-001101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip

0 -
RFQ
116-87-306-41-001101

데이터시트

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
A-CCS32-Z-SM-R

A-CCS32-Z-SM-R

CONN SOCKET PLCC 32POS TIN

Assmann WSW Components

0 -
RFQ
A-CCS32-Z-SM-R

데이터시트

- Tube Obsolete PLCC 32 (2 x 7, 2 x 9) 0.050" (1.27mm) Tin 150.0µin (3.81µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 150.0µin (3.81µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 105°C
A-CCS020-Z-SM/P

A-CCS020-Z-SM/P

SOCKET

Assmann WSW Components

0 -
RFQ

-

- Bulk Active PLCC 20 0.050" (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze Through Hole Closed Frame Solder 0.050" (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze Polyphenylene Sulfide (PPS), Glass Filled -40°C ~ 105°C
AW 127-38/Z-T

AW 127-38/Z-T

SOCKET 38 CONTACTS SINGLE ROW

Assmann WSW Components

0 -
RFQ
AW 127-38/Z-T

데이터시트

- - Active - - - - - - - - - - - - - - -
410-87-214-10-001101

410-87-214-10-001101

CONN ZIG-ZAG 14POS GOLD

Preci-Dip

0 -
RFQ
410-87-214-10-001101

데이터시트

410 Bulk Active Zig-Zag 14 (2 x 7) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
410-87-214-10-002101

410-87-214-10-002101

CONN ZIG-ZAG 14POS GOLD

Preci-Dip

0 -
RFQ
410-87-214-10-002101

데이터시트

410 Bulk Active Zig-Zag 14 (2 x 7) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
124-83-304-41-002101

124-83-304-41-002101

CONN IC DIP SOCKET 4POS GOLD

Preci-Dip

0 -
RFQ

-

124 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-87-610-41-006101

116-87-610-41-006101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0 -
RFQ
116-87-610-41-006101

데이터시트

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
1051670001

1051670001

SMIA65 TOP MNT CAMERA SOCKET

Molex

0 -
RFQ
1051670001

데이터시트

105167 Tape & Reel (TR) Obsolete Camera Socket 12 (2 x 6) 0.037" (0.95mm) Gold 12.0µin (0.30µm) Copper Alloy Surface Mount Open Frame Solder - Gold Flash Copper Alloy Thermoplastic -55°C ~ 85°C
122-83-306-41-001101

122-83-306-41-001101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip

0 -
RFQ
122-83-306-41-001101

데이터시트

122 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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