IC 소켓

제조업체 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도

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결과
사진 제조사 부품 번호 재고 상태 가격 수량 데이터시트 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도
110-83-640-41-001000

110-83-640-41-001000

STANDRD SOLDER TAIL DIP SOCKET

Mill-Max Manufacturing Corp.

0 -
RFQ

-

- Tube Active - - - - - - - - - - - - - - -
100-PRS10001-12

100-PRS10001-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0 -
RFQ
100-PRS10001-12

데이터시트

PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
40-6556-40

40-6556-40

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

0 -
RFQ
40-6556-40

데이터시트

6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder Cup 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
514-83-420M26-001148

514-83-420M26-001148

CONN SOCKET BGA 420POS GOLD

Preci-Dip

0 -
RFQ
514-83-420M26-001148

데이터시트

514 Bulk Active BGA 420 (26 x 26) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
550-10-381-18-101135

550-10-381-18-101135

PGA SOLDER TAIL

Preci-Dip

0 -
RFQ
550-10-381-18-101135

데이터시트

550 Bulk Active PGA 381 (18 x 18) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
HLS-0520-T-18

HLS-0520-T-18

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
RFQ
HLS-0520-T-18

데이터시트

HLS Bulk Active SIP 100 (5 x 20) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
614-83-320-19-131144

614-83-320-19-131144

CONN SOCKET PGA 320POS GOLD

Preci-Dip

0 -
RFQ
614-83-320-19-131144

데이터시트

614 Bulk Active PGA 320 (19 x 19) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
558-10-352M26-001104

558-10-352M26-001104

BGA SURFACE MOUNT 1.27MM

Preci-Dip

0 -
RFQ
558-10-352M26-001104

데이터시트

558 Bulk Active BGA 352 (26 x 26) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass Surface Mount Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
132-PGM13038-50

132-PGM13038-50

CONN SOCKET PGA GOLD

Aries Electronics

0 -
RFQ

-

PGM - Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
614-83-321-19-121144

614-83-321-19-121144

CONN SOCKET PGA 321POS GOLD

Preci-Dip

0 -
RFQ
614-83-321-19-121144

데이터시트

614 Bulk Active PGA 321 (21 x 21) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
518-77-352M26-001105

518-77-352M26-001105

CONN SOCKET PGA 352POS GOLD

Preci-Dip

0 -
RFQ
518-77-352M26-001105

데이터시트

518 Bulk Active PGA 352 (26 x 26) 0.050" (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.050" (1.27mm) Gold Flash Brass FR4 Epoxy Glass -55°C ~ 125°C
110-33-314-41-001000

110-33-314-41-001000

STANDRD SOLDER TAIL DIP SOCKET

Mill-Max Manufacturing Corp.

0 -
RFQ

-

- Tube Active - - - - - - - - - - - - - - -
44-536-11

44-536-11

CONN SOCKET PLCC ZIF 44POS GOLD

Aries Electronics

0 -
RFQ

-

536 - Obsolete PLCC, ZIF (ZIP) 44 (4 x 11) 0.050" (1.27mm) Gold 12.0µin (0.30µm) - Through Hole Open Frame - - - - - - -
32-3574-16

32-3574-16

CONN IC DIP SOCKET ZIF 32POS

Aries Electronics

0 -
RFQ
32-3574-16

데이터시트

57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled -
558-10-356M26-001104

558-10-356M26-001104

BGA SURFACE MOUNT 1.27MM

Preci-Dip

0 -
RFQ
558-10-356M26-001104

데이터시트

558 Bulk Active BGA 356 (26 x 26) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass Surface Mount Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
550-10-400M20-000152

550-10-400M20-000152

BGA SOLDER TAIL

Preci-Dip

0 -
RFQ
550-10-400M20-000152

데이터시트

550 Bulk Active BGA 400 (20 x 20) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
546-83-463-19-101147

546-83-463-19-101147

CONN SOCKET PGA 463POS GOLD

Preci-Dip

0 -
RFQ
546-83-463-19-101147

데이터시트

546 Bulk Active PGA 463 (19 x 19) 0.050" (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
558-10-357M19-001104

558-10-357M19-001104

BGA SURFACE MOUNT 1.27MM

Preci-Dip

0 -
RFQ
558-10-357M19-001104

데이터시트

558 Bulk Active BGA 357 (19 x 19) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass Surface Mount Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
550-10-576M30-001166

550-10-576M30-001166

BGA PIN ADAPTER 1.27MM SMD

Preci-Dip

0 -
RFQ
550-10-576M30-001166

데이터시트

550 Bulk Active BGA 576 (30 x 30) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
518-77-356M26-001105

518-77-356M26-001105

CONN SOCKET PGA 356POS GOLD

Preci-Dip

0 -
RFQ
518-77-356M26-001105

데이터시트

518 Bulk Active PGA 356 (26 x 26) 0.050" (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.050" (1.27mm) Gold Flash Brass FR4 Epoxy Glass -55°C ~ 125°C
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