24시간 이용 가능:
0755-82798135IC 소켓
| 사진 | 제조사 부품 번호 | 재고 상태 | 가격 | 수량 | 데이터시트 | 시리즈 | 패키징 | 제품 상태 | 유형 | 위치 또는 핀 수(그리드) | 피치 - Mating | 접촉 마감 - 결합 | 접촉 마감 두께 - Mating | 접촉 재료 - Mating | 장착 유형 | 기능 | 종단 | 피치 - 포스트 | 접촉 마감 - 포스트 | 접촉 마감 두께 - 포스트 | 접촉 재료 - 포스트 | 하우징 소재 | 작동 온도 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
518-77-357M19-001105CONN SOCKET PGA 357POS GOLD |
0 | - |
|
데이터시트 |
518 | Bulk | Active | PGA | 357 (19 x 19) | 0.050" (1.27mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.050" (1.27mm) | Gold | Flash | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
|
110-33-628-41-530000CONN IC DIP SOCKET 28POS GOLD |
0 | - |
|
- |
110 | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | - | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | - | - | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
210-33-628-41-101000SOCKET IC CLOSED FRM .300 28POS |
0 | - |
|
- |
210 | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
210-33-316-41-001000STANDRD SOLDER TAIL DIP SOCKET |
0 | - |
|
데이터시트 |
210 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Brass | Thermoplastic | -55°C ~ 125°C |
|
110-33-316-41-001000STANDRD SOLDER TAIL DIP SOCKET |
0 | - |
|
- |
- | Tube | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
36-3551-16CONN IC DIP SOCKET ZIF 36POS |
0 | - |
|
데이터시트 |
55 | Bulk | Active | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 36 (2 x 18) | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - |
|
558-10-360M19-001104BGA SURFACE MOUNT 1.27MM |
0 | - |
|
데이터시트 |
558 | Bulk | Active | BGA | 360 (19 x 19) | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
|
518-77-352M26-001106CONN SOCKET PGA 352POS GOLD |
0 | - |
|
데이터시트 |
518 | Bulk | Active | PGA | 352 (26 x 26) | 0.050" (1.27mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.050" (1.27mm) | Gold | Flash | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
|
1109042537 ZIF TEST SCKT LIVE BUG TYPE |
0 | - |
|
데이터시트 |
- | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
514-83-432M31-001148CONN SOCKET BGA 432POS GOLD |
0 | - |
|
데이터시트 |
514 | Bulk | Active | BGA | 432 (31 x 31) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
518-77-360M19-001105CONN SOCKET PGA 360POS GOLD |
0 | - |
|
데이터시트 |
518 | Bulk | Active | PGA | 360 (19 x 19) | 0.050" (1.27mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.050" (1.27mm) | Gold | Flash | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
|
514-87-560M33-001148CONN SOCKET BGA 560POS GOLD |
0 | - |
|
데이터시트 |
514 | Bulk | Active | BGA | 560 (33 x 33) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
210-33-320-41-001000STANDRD SOLDER TAIL DIP SOCKET |
0 | - |
|
- |
- | Tube | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
518-77-356M26-001106CONN SOCKET PGA 356POS GOLD |
0 | - |
|
데이터시트 |
518 | Bulk | Active | PGA | 356 (26 x 26) | 0.050" (1.27mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.050" (1.27mm) | Gold | Flash | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
|
281-PGM18037-11CONN SOCKET PGA GOLD |
0 | - |
|
데이터시트 |
PGM | Bulk | Active | PGA | - | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 125°C |
|
210-33-632-41-101000CONN IC SKT DBL |
0 | - |
|
데이터시트 |
210 | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
110-33-318-41-001000STANDRD SOLDER TAIL DIP SOCKET |
0 | - |
|
- |
- | Tube | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
210-33-318-41-001000STANDRD SOLDER TAIL DIP SOCKET |
0 | - |
|
- |
- | Tube | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
518-77-357M19-001106CONN SOCKET PGA 357POS GOLD |
0 | - |
|
데이터시트 |
518 | Bulk | Active | PGA | 357 (19 x 19) | 0.050" (1.27mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.050" (1.27mm) | Gold | Flash | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
|
558-10-388M26-001101PGA SOLDER TAIL 1.27MM |
0 | - |
|
데이터시트 |
558 | Bulk | Active | PGA | 388 (26 x 26) | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |

