IC 소켓

제조업체 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도

모두 초기화
모두 적용
결과
사진 제조사 부품 번호 재고 상태 가격 수량 데이터시트 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도
APH-1836-G-R

APH-1836-G-R

APH-1836-G-R

Samtec Inc.

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RFQ

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APH-0536-G-R

APH-0536-G-R

APH-0536-G-R

Samtec Inc.

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RFQ

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APH-1436-G-R

APH-1436-G-R

APH-1436-G-R

Samtec Inc.

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RFQ

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APH-0936-G-R

APH-0936-G-R

APH-0936-G-R

Samtec Inc.

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RFQ

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APH-1036-G-R

APH-1036-G-R

APH-1036-G-R

Samtec Inc.

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APH-1536-G-R

APH-1536-G-R

APH-1536-G-R

Samtec Inc.

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RFQ

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APH-0736-G-R

APH-0736-G-R

APH-0736-G-R

Samtec Inc.

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RFQ

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APH-0836-G-R

APH-0836-G-R

APH-0836-G-R

Samtec Inc.

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RFQ

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APH-0336-G-R

APH-0336-G-R

APH-0336-G-R

Samtec Inc.

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RFQ

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APH-1636-G-R

APH-1636-G-R

APH-1636-G-R

Samtec Inc.

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RFQ

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* - Active - - - - - - - - - - - - - - -
APH-0436-G-R

APH-0436-G-R

APH-0436-G-R

Samtec Inc.

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RFQ

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APH-0636-G-R

APH-0636-G-R

APH-0636-G-R

Samtec Inc.

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48-3570-11

48-3570-11

CONN IC DIP SOCKET ZIF 48POS GLD

Aries Electronics

0 -
RFQ
48-3570-11

데이터시트

57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
48-3571-11

48-3571-11

CONN IC DIP SOCKET ZIF 48POS GLD

Aries Electronics

0 -
RFQ
48-3571-11

데이터시트

57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
48-3573-11

48-3573-11

CONN IC DIP SOCKET ZIF 48POS GLD

Aries Electronics

0 -
RFQ
48-3573-11

데이터시트

57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
48-3575-11

48-3575-11

CONN IC DIP SOCKET ZIF 48POS TIN

Aries Electronics

0 -
RFQ
48-3575-11

데이터시트

57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
48-6570-11

48-6570-11

CONN IC DIP SOCKET ZIF 48POS GLD

Aries Electronics

0 -
RFQ
48-6570-11

데이터시트

57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
48-6571-11

48-6571-11

CONN IC DIP SOCKET ZIF 48POS GLD

Aries Electronics

0 -
RFQ
48-6571-11

데이터시트

57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
48-6572-11

48-6572-11

CONN IC DIP SOCKET ZIF 48POS GLD

Aries Electronics

0 -
RFQ
48-6572-11

데이터시트

57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
48-6573-11

48-6573-11

CONN IC DIP SOCKET ZIF 48POS GLD

Aries Electronics

0 -
RFQ
48-6573-11

데이터시트

57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
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