IC 소켓

제조업체 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도

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결과
사진 제조사 부품 번호 재고 상태 가격 수량 데이터시트 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도
APH-1520-G-R

APH-1520-G-R

APH-1520-G-R

Samtec Inc.

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RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1120-G-R

APH-1120-G-R

APH-1120-G-R

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0420-G-R

APH-0420-G-R

APH-0420-G-R

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1320-G-R

APH-1320-G-R

APH-1320-G-R

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
110-93-624-61-801000

110-93-624-61-801000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
RFQ

-

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
510-13-044-08-031003

510-13-044-08-031003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

0 -
RFQ
510-13-044-08-031003

데이터시트

510 Bulk Active PGA 44 (8 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
48-3551-11

48-3551-11

CONN IC DIP SOCKET ZIF 48POS GLD

Aries Electronics

0 -
RFQ
48-3551-11

데이터시트

55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
48-3552-11

48-3552-11

CONN IC DIP SOCKET ZIF 48POS GLD

Aries Electronics

0 -
RFQ
48-3552-11

데이터시트

55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
48-6551-11

48-6551-11

CONN IC DIP SOCKET ZIF 48POS GLD

Aries Electronics

0 -
RFQ
48-6551-11

데이터시트

55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
48-6552-11

48-6552-11

CONN IC DIP SOCKET ZIF 48POS GLD

Aries Electronics

0 -
RFQ
48-6552-11

데이터시트

55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
48-6553-11

48-6553-11

CONN IC DIP SOCKET ZIF 48POS GLD

Aries Electronics

0 -
RFQ
48-6553-11

데이터시트

55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
48-3554-11

48-3554-11

CONN IC DIP SOCKET ZIF 48POS GLD

Aries Electronics

0 -
RFQ
48-3554-11

데이터시트

55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
116-43-642-61-001000

116-43-642-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
RFQ

-

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
127-43-764-41-003000

127-43-764-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
RFQ
127-43-764-41-003000

데이터시트

127 Tube Active DIP, 0.75" (19.05mm) Row Spacing 64 (2 x 32) 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.070" (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-83-179-18-111112

614-83-179-18-111112

CONN SOCKET PGA 179POS GOLD

Preci-Dip

0 -
RFQ
614-83-179-18-111112

데이터시트

614 Bulk Active PGA 179 (18 x 18) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
614-83-179-18-112112

614-83-179-18-112112

CONN SOCKET PGA 179POS GOLD

Preci-Dip

0 -
RFQ
614-83-179-18-112112

데이터시트

614 Bulk Active PGA 179 (18 x 18) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
614-87-225-17-061112

614-87-225-17-061112

CONN SOCKET PGA 225POS GOLD

Preci-Dip

0 -
RFQ
614-87-225-17-061112

데이터시트

614 Bulk Active PGA 225 (17 x 17) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
110-43-952-61-001000

110-43-952-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
RFQ

-

110 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
200-6325-NUN-8100

200-6325-NUN-8100

CAMLEVER-STANDARD

3M

0 -
RFQ

-

Textool™ Bulk Obsolete PGA, ZIF (ZIP) 625 (25 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES) -55°C ~ 150°C
36-6556-31

36-6556-31

CONN IC DIP SOCKET 36POS GOLD

Aries Electronics

0 -
RFQ
36-6556-31

데이터시트

6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
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