IC 소켓

제조업체 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도

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결과
사진 제조사 부품 번호 재고 상태 가격 수량 데이터시트 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도
126-43-964-41-002000

126-43-964-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
RFQ
126-43-964-41-002000

데이터시트

126 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-43-428-61-008000

116-43-428-61-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
RFQ

-

116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-93-328-61-008000

116-93-328-61-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
RFQ

-

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
111-43-648-61-001000

111-43-648-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
RFQ

-

111 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
111-93-648-61-001000

111-93-648-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
RFQ

-

111 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
550-10-256M16-000166

550-10-256M16-000166

BGA PIN ADAPTER 1.27MM SMD

Preci-Dip

0 -
RFQ
550-10-256M16-000166

데이터시트

550 Bulk Active BGA 256 (16 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
550-10-256M20-001166

550-10-256M20-001166

BGA PIN ADAPTER 1.27MM SMD

Preci-Dip

0 -
RFQ
550-10-256M20-001166

데이터시트

550 Bulk Active BGA 256 (20 x 20) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
115-93-964-61-001000

115-93-964-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
RFQ

-

115 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
117-93-642-61-005000

117-93-642-61-005000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
RFQ

-

117 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
117-43-664-61-005000

117-43-664-61-005000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
RFQ

-

117 Tube Active DIP, 0.6" (15.24mm) Row Spacing 64 (2 x 32) 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
117-43-764-61-005000

117-43-764-61-005000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
RFQ

-

117 Tube Active DIP, 0.75" (19.05mm) Row Spacing 64 (2 x 32) 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
117-93-664-61-005000

117-93-664-61-005000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
RFQ

-

117 Tube Active DIP, 0.6" (15.24mm) Row Spacing 64 (2 x 32) 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
123-13-652-41-001000

123-13-652-41-001000

CONN IC DIP SOCKET 52POS GOLD

Mill-Max Manufacturing Corp.

0 -
RFQ
123-13-652-41-001000

데이터시트

123 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
712-13-164-41-001000

712-13-164-41-001000

SOCKET CARRIER SIP 64POS

Mill-Max Manufacturing Corp.

0 -
RFQ
712-13-164-41-001000

데이터시트

712 Tube Active SIP 64 (1 x 64) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-43-950-61-001000

110-43-950-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
RFQ

-

110 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-93-950-61-001000

110-93-950-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
RFQ

-

110 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-43-640-61-001000

116-43-640-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
RFQ

-

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
40-6556-31

40-6556-31

UNIV TEST SOCKET RECEPT 6556

Aries Electronics

0 -
RFQ

-

6556 - Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyphenylene Sulfide (PPS), Glass Filled 150°C
40-3503-21

40-3503-21

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

0 -
RFQ
40-3503-21

데이터시트

503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
40-3503-31

40-3503-31

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

0 -
RFQ
40-3503-31

데이터시트

503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
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