IC 소켓

제조업체 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도

모두 초기화
모두 적용
결과
사진 제조사 부품 번호 재고 상태 가격 수량 데이터시트 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도
APO-316-G-B

APO-316-G-B

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
RFQ
APO-316-G-B

데이터시트

APO Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
APH-0614-G-T

APH-0614-G-T

APH-0614-G-T

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0414-G-T

APH-0414-G-T

APH-0414-G-T

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1614-G-T

APH-1614-G-T

APH-1614-G-T

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
614-93-642-31-018000

614-93-642-31-018000

CONN IC DIP SOCKET 42POS GOLD

Mill-Max Manufacturing Corp.

0 -
RFQ
614-93-642-31-018000

데이터시트

614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-43-642-31-018000

614-43-642-31-018000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
RFQ
614-43-642-31-018000

데이터시트

614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
ICA-628-ZHGG

ICA-628-ZHGG

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
RFQ
ICA-628-ZHGG

데이터시트

ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
546-83-145-15-081135

546-83-145-15-081135

CONN SOCKET PGA 145POS GOLD

Preci-Dip

0 -
RFQ
546-83-145-15-081135

데이터시트

546 Bulk Active PGA 145 (15 x 15) 0.050" (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
546-83-145-15-081136

546-83-145-15-081136

CONN SOCKET PGA 145POS GOLD

Preci-Dip

0 -
RFQ
546-83-145-15-081136

데이터시트

546 Bulk Active PGA 145 (15 x 15) 0.050" (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
34-6621-30

34-6621-30

CONN IC DIP SOCKET 34POS TIN

Aries Electronics

0 -
RFQ
34-6621-30

데이터시트

6621 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 34 (2 x 17) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Bottom Entry; Through Board Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
69-PGM11030-11

69-PGM11030-11

CONN SOCKET PGA GOLD

Aries Electronics

0 -
RFQ
69-PGM11030-11

데이터시트

PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
69-PGM11031-11

69-PGM11031-11

CONN SOCKET PGA GOLD

Aries Electronics

0 -
RFQ
69-PGM11031-11

데이터시트

PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
69-PGM11053-11

69-PGM11053-11

CONN SOCKET PGA GOLD

Aries Electronics

0 -
RFQ
69-PGM11053-11

데이터시트

PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
132-PGM14016-10

132-PGM14016-10

CONN SOCKET PGA GOLD

Aries Electronics

0 -
RFQ
132-PGM14016-10

데이터시트

PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
612-41-640-41-003000

612-41-640-41-003000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

0 -
RFQ
612-41-640-41-003000

데이터시트

612 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
612-91-640-41-003000

612-91-640-41-003000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

0 -
RFQ
612-91-640-41-003000

데이터시트

612 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
104-13-640-41-770000

104-13-640-41-770000

CONN IC DIP SOCKET 40POS GOLD

Mill-Max Manufacturing Corp.

0 -
RFQ
104-13-640-41-770000

데이터시트

104 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Thermoplastic -
116-41-650-41-008000

116-41-650-41-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
RFQ
116-41-650-41-008000

데이터시트

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-91-650-41-008000

116-91-650-41-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
RFQ
116-91-650-41-008000

데이터시트

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
APH-1818-G-T

APH-1818-G-T

APH-1818-G-T

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
Total 19086 Record«Prev1... 718719720721722723724725...955Next»
TomatoElec

검색

TomatoElec

제품

TomatoElec

전화번호

TomatoElec

사용자