IC 소켓

제조업체 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도

모두 초기화
모두 적용
결과
사진 제조사 부품 번호 재고 상태 가격 수량 데이터시트 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도
APH-1830-T-R

APH-1830-T-R

APH-1830-T-R

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1834-T-T

APH-1834-T-T

APH-1834-T-T

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1034-T-T

APH-1034-T-T

APH-1034-T-T

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1930-T-R

APH-1930-T-R

APH-1930-T-R

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1534-T-T

APH-1534-T-T

APH-1534-T-T

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0734-T-T

APH-0734-T-T

APH-0734-T-T

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1234-T-T

APH-1234-T-T

APH-1234-T-T

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1634-T-T

APH-1634-T-T

APH-1634-T-T

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0230-T-R

APH-0230-T-R

APH-0230-T-R

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1734-T-T

APH-1734-T-T

APH-1734-T-T

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0234-T-T

APH-0234-T-T

APH-0234-T-T

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0834-T-T

APH-0834-T-T

APH-0834-T-T

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1334-T-T

APH-1334-T-T

APH-1334-T-T

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
545092-4

545092-4

CONN SOCKET PGA 48POS TIN-LEAD

TE Connectivity AMP Connectors

0 -
RFQ
545092-4

데이터시트

- Tube Obsolete PGA 48 (4 x 12) 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) Brass Polybutylene Terephthalate (PBT) -40°C ~ 105°C
HLS-0313-G-11

HLS-0313-G-11

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
RFQ
HLS-0313-G-11

데이터시트

HLS Tube Active SIP 39 (3 x 13) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
126-41-432-41-003000

126-41-432-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
RFQ
126-41-432-41-003000

데이터시트

126 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
126-41-632-41-003000

126-41-632-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
RFQ
126-41-632-41-003000

데이터시트

126 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
126-91-432-41-003000

126-91-432-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
RFQ
126-91-432-41-003000

데이터시트

126 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
126-91-632-41-003000

126-91-632-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
RFQ
126-91-632-41-003000

데이터시트

126 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
68-PGM11032-11

68-PGM11032-11

CONN SOCKET PGA GOLD

Aries Electronics

0 -
RFQ
68-PGM11032-11

데이터시트

PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
Total 19086 Record«Prev1... 715716717718719720721722...955Next»
TomatoElec

검색

TomatoElec

제품

TomatoElec

전화번호

TomatoElec

사용자