IC 소켓

제조업체 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도

모두 초기화
모두 적용
결과
사진 제조사 부품 번호 재고 상태 가격 수량 데이터시트 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도
APA-640-G-P

APA-640-G-P

ADAPTER PLUG

Samtec Inc.

0 -
RFQ
APA-640-G-P

데이터시트

APA Bulk Active - 40 (2 x 20) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
2174988-1

2174988-1

CONN SOCKET LGA 2011POS GOLD

TE Connectivity AMP Connectors

0 -
RFQ
2174988-1

데이터시트

- Bulk Obsolete LGA 2011 (47 x 58) 0.040" (1.02mm) Gold 15.0µin (0.38µm) Copper Alloy Surface Mount Closed Frame Solder 0.035" (0.90mm) Gold 15.0µin (0.38µm) Copper Alloy Thermoplastic -
6-1437522-9

6-1437522-9

STAMPED PIN

TE Connectivity AMP Connectors

0 -
RFQ
6-1437522-9

데이터시트

- Bulk Active - - - - - - - - - - - - - - -
523-93-121-13-061001

523-93-121-13-061001

PGA SOCK 121PIN 13X13 WIRE WRAP

Mill-Max Manufacturing Corp.

295 -
RFQ
523-93-121-13-061001

데이터시트

523 Bulk Active PGA 121 (13 x 13) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole - Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -
21218NE

21218NE

CONN IC DIP SOCKET 8POS

Marutsuelec

2,268 -
RFQ
21218NE

데이터시트

- Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) - - - Through Hole Open Frame - 0.100" (2.54mm) - - - - -40°C ~ 105°C
212014NE

212014NE

CONN IC DIP SOCKET 14POS

Marutsuelec Co., Ltd.

1,214 -
RFQ
212014NE

데이터시트

- Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) - - - Through Hole Open Frame - 0.100" (2.54mm) - - - - -30°C ~ 85°C
212016NE

212016NE

CONN IC DIP SOCKET 16POS

Marutsuelec Co., Ltd.

1,364 -
RFQ
212016NE

데이터시트

- Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) - - - Through Hole Open Frame - 0.100" (2.54mm) - - - - -30°C ~ 85°C
212024WE

212024WE

CONN IC DIP SOCKET 24POS

Marutsuelec Co., Ltd.

1,892 -
RFQ
212024WE

데이터시트

- Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) - - - Through Hole Open Frame - 0.100" (2.54mm) - - - - -30°C ~ 85°C
212114NE

212114NE

CONN IC DIP SOCKET 14POS

Marutsuelec

1,559 -
RFQ
212114NE

데이터시트

- Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) - - - Through Hole Open Frame - 0.100" (2.54mm) - - - - -40°C ~ 105°C
212116NE

212116NE

CONN IC DIP SOCKET 16POS

Marutsuelec

1,764 -
RFQ
212116NE

데이터시트

- Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) - - - Through Hole Open Frame - 0.100" (2.54mm) - - - - -40°C ~ 105°C
212124NE

212124NE

CONN IC DIP SOCKET 24POS

Marutsuelec

489 -
RFQ
212124NE

데이터시트

- Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) - - - Through Hole Open Frame - 0.100" (2.54mm) - - - - -40°C ~ 105°C
212128NE

212128NE

CONN IC DIP SOCKET 28POS

Marutsuelec

1,023 -
RFQ
212128NE

데이터시트

- Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) - - - Through Hole Open Frame - 0.100" (2.54mm) - - - - -40°C ~ 105°C
212132WE

212132WE

CONN IC DIP SOCKET 32POS

Marutsuelec

575 -
RFQ
212132WE

데이터시트

- Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) - - - Through Hole Open Frame - 0.100" (2.54mm) - - - - -40°C ~ 105°C
212140WE

212140WE

CONN IC DIP SOCKET 40POS

Marutsuelec

216 -
RFQ
212140WE

데이터시트

- Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) - - - Through Hole Open Frame - 0.100" (2.54mm) - - - - -40°C ~ 105°C
2-1571552-6

2-1571552-6

820-AG11D-ESL-LF=800 DIP GF/SN

TE Connectivity AMP Connectors

2,010 -
RFQ
2-1571552-6

데이터시트

800 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 180.0µin (4.57µm) Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 105°C
820-AG11D-ESL-LF

820-AG11D-ESL-LF

IC SOCKET, DIP20, 20 CONTACT(S),

TE Connectivity AMP Connectors

2,010 -
RFQ
820-AG11D-ESL-LF

데이터시트

800 Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 180.0µin (4.57µm) Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 105°C
3-1571552-2

3-1571552-2

840-AG11D-ESL-LF=800 DIP GF/SN

TE Connectivity AMP Connectors

5,833 -
RFQ
3-1571552-2

데이터시트

800 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 105°C
840-AG11D-ESL-LF

840-AG11D-ESL-LF

IC SOCKET, DIP40, 40 CONTACT(S),

TE Connectivity AMP Connectors

5,833 -
RFQ
840-AG11D-ESL-LF

데이터시트

800 Bulk Obsolete DIP, 0.6" (15.24mm) Row Spacing 40 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 105°C
110-87-210-41-001101

110-87-210-41-001101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

416 -
RFQ
110-87-210-41-001101

데이터시트

110 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
SA203000

SA203000

CONN IC DIP SOCKET 20POS GOLD

On Shore Technology Inc.

645 -
RFQ
SA203000

데이터시트

SA Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Thermoplastic, Polyester, Glass Filled -40°C ~ 105°C
Total 19086 Record«Prev1... 4748495051525354...955Next»
TomatoElec

검색

TomatoElec

제품

TomatoElec

전화번호

TomatoElec

사용자