IC 소켓

제조업체 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도

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결과
사진 제조사 부품 번호 재고 상태 가격 수량 데이터시트 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도
123-43-422-41-001000

123-43-422-41-001000

CONN IC DIP SOCKET 22POS GOLD

Mill-Max Manufacturing Corp.

165 -
RFQ
123-43-422-41-001000

데이터시트

123 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
299-93-306-10-001000

299-93-306-10-001000

CONN IC DIP SOCKET 6POS GOLD

Mill-Max Manufacturing Corp.

543 -
RFQ
299-93-306-10-001000

데이터시트

299 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
123-43-424-41-001000

123-43-424-41-001000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.

300 -
RFQ
123-43-424-41-001000

데이터시트

123 Tube Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
612-11-420-41-001000

612-11-420-41-001000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

223 -
RFQ
612-11-420-41-001000

데이터시트

612 Tube Active DIP, 0.1" (2.54mm) Row Spacing - 0.039" (1.00mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.039" (1.00mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
123-93-320-41-801000

123-93-320-41-801000

CONN IC DIP SOCKET 20POS GOLD

Mill-Max Manufacturing Corp.

104 -
RFQ
123-93-320-41-801000

데이터시트

123 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
210815-4

210815-4

CONN SOCKET PGA 223POS GOLD

TE Connectivity AMP Connectors

0 -
RFQ
210815-4

데이터시트

- Tube Obsolete PGA 223 (18 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin-Lead 196.9µin (5.00µm) Phosphor Bronze Thermoplastic, Polyester, Glass Filled -
2174988-2

2174988-2

CONN SOCKET LGA 2011POS GOLD

TE Connectivity AMP Connectors

0 -
RFQ
2174988-2

데이터시트

- Bulk Obsolete LGA 2011 (47 x 58) 0.040" (1.02mm) Gold 30.0µin (0.76µm) Copper Alloy Surface Mount Open Frame Solder 0.035" (0.90mm) Gold 30.0µin (0.76µm) Copper Alloy Thermoplastic -
2-822064-4

2-822064-4

CONN SOCKET PQFP 100POS TIN-LEAD

TE Connectivity AMP Connectors

0 -
RFQ
2-822064-4

데이터시트

- Tube Obsolete QFP 100 (4 x 25) 0.025" (0.64mm) Tin-Lead 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Solder 0.025" (0.64mm) Tin-Lead 200.0µin (5.08µm) Phosphor Bronze Liquid Crystal Polymer (LCP) -
123-43-318-41-801000

123-43-318-41-801000

CONN IC DIP SOCKET 18POS GOLD

Mill-Max Manufacturing Corp.

239 -
RFQ
123-43-318-41-801000

데이터시트

123 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
299-43-318-11-001000

299-43-318-11-001000

CONN IC DIP SOCKET 18POS GOLD

Mill-Max Manufacturing Corp.

197 -
RFQ
299-43-318-11-001000

데이터시트

299 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
299-93-324-11-001000

299-93-324-11-001000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.

157 -
RFQ
299-93-324-11-001000

데이터시트

299 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
299-43-614-10-002000

299-43-614-10-002000

CONN IC DIP SOCKET 14POS GOLD

Mill-Max Manufacturing Corp.

201 -
RFQ
299-43-614-10-002000

데이터시트

299 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
5-1437504-8

5-1437504-8

TRANSISTOR SKT

TE Connectivity Potter & Brumfield Relays

0 -
RFQ
5-1437504-8

데이터시트

8080 Bulk Obsolete - - - - - - - - - - - - - - -
299-93-622-10-002000

299-93-622-10-002000

CONN IC DIP SOCKET 22POS GOLD

Mill-Max Manufacturing Corp.

195 -
RFQ
299-93-622-10-002000

데이터시트

299 Tube Active DIP, 0.6" (15.24mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
1-1554653-1

1-1554653-1

CONN SOCKET LGA 2011POS GOLD

TE Connectivity AMP Connectors

0 -
RFQ
1-1554653-1

데이터시트

- Tray Obsolete LGA 2011 (47 x 58) - Gold 30.0µin (0.76µm) Copper Alloy Surface Mount Open Frame Solder - Gold 30.0µin (0.76µm) Copper Alloy Thermoplastic -
ICA-640-JGG

ICA-640-JGG

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
RFQ
ICA-640-JGG

데이터시트

ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
123-43-950-41-001000

123-43-950-41-001000

CONN IC DIP SOCKET 50POS GOLD

Mill-Max Manufacturing Corp.

179 -
RFQ
123-43-950-41-001000

데이터시트

123 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
123-43-640-41-801000

123-43-640-41-801000

CONN IC DIP SOCKET 40POS GOLD

Mill-Max Manufacturing Corp.

145 -
RFQ
123-43-640-41-801000

데이터시트

123 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
6-1437562-9

6-1437562-9

TT41NGRA1=SW TOGGLE 4 POLE R/A

TE Connectivity ALCOSWITCH Switches

212 -
RFQ
6-1437562-9

데이터시트

* Box Active - - - - - - - - - - - - - - -
299-93-636-10-002000

299-93-636-10-002000

CONN IC DIP SOCKET 36POS GOLD

Mill-Max Manufacturing Corp.

183 -
RFQ
299-93-636-10-002000

데이터시트

299 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
Total 19086 Record«Prev1... 4647484950515253...955Next»
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