IC 소켓

제조업체 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도

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결과
사진 제조사 부품 번호 재고 상태 가격 수량 데이터시트 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도
APH-1122-T-H

APH-1122-T-H

APH-1122-T-H

Samtec Inc.

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RFQ

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* - Active - - - - - - - - - - - - - - -
APH-0222-T-H

APH-0222-T-H

APH-0222-T-H

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1722-T-H

APH-1722-T-H

APH-1722-T-H

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1222-T-H

APH-1222-T-H

APH-1222-T-H

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1622-T-H

APH-1622-T-H

APH-1622-T-H

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0722-T-H

APH-0722-T-H

APH-0722-T-H

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0322-T-H

APH-0322-T-H

APH-0322-T-H

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1322-T-H

APH-1322-T-H

APH-1322-T-H

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0822-T-H

APH-0822-T-H

APH-0822-T-H

Samtec Inc.

0 -
RFQ

-

* - Active - - - - - - - - - - - - - - -
ICO-632-ZCGT

ICO-632-ZCGT

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
RFQ
ICO-632-ZCGT

데이터시트

ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
28-6511-11

28-6511-11

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

0 -
RFQ
28-6511-11

데이터시트

511 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
116-47-308-41-006000

116-47-308-41-006000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.

0 -
RFQ
116-47-308-41-006000

데이터시트

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-41-306-41-008000

116-41-306-41-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
RFQ
116-41-306-41-008000

데이터시트

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-91-306-41-008000

116-91-306-41-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
RFQ
116-91-306-41-008000

데이터시트

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
HLS-0211-G-11

HLS-0211-G-11

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
RFQ
HLS-0211-G-11

데이터시트

HLS Tube Active SIP 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
828-AG12D

828-AG12D

CONN IC DIP SOCKET 28POS TINLEAD

TE Connectivity AMP Connectors

0 -
RFQ
828-AG12D

데이터시트

800 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin-Lead - Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead - Copper Alloy Polyester -55°C ~ 105°C
24-3503-30

24-3503-30

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

0 -
RFQ
24-3503-30

데이터시트

503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
22-0503-20

22-0503-20

CONN SOCKET SIP 22POS GOLD

Aries Electronics

0 -
RFQ
22-0503-20

데이터시트

0503 Bulk Active SIP 22 (1 x 22) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled -
22-0503-30

22-0503-30

CONN SOCKET SIP 22POS GOLD

Aries Electronics

0 -
RFQ
22-0503-30

데이터시트

0503 Bulk Active SIP 22 (1 x 22) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled -
317-91-106-41-005000

317-91-106-41-005000

CONN SKT SNG

Mill-Max Manufacturing Corp.

0 -
RFQ
317-91-106-41-005000

데이터시트

317 Bulk Active SIP 6 (1 x 6) 0.070" (1.78mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.070" (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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