IC 소켓

제조업체 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도

모두 초기화
모두 적용
결과
사진 제조사 부품 번호 재고 상태 가격 수량 데이터시트 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도
17-0508-21

17-0508-21

CONN SOCKET SIP 17POS GOLD

Aries Electronics

0 -
RFQ
17-0508-21

데이터시트

508 Bulk Active SIP 17 (1 x 17) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
17-0508-31

17-0508-31

CONN SOCKET SIP 17POS GOLD

Aries Electronics

0 -
RFQ
17-0508-31

데이터시트

508 Bulk Active SIP 17 (1 x 17) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
110-41-308-41-105000

110-41-308-41-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
RFQ
110-41-308-41-105000

데이터시트

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-91-308-41-105000

110-91-308-41-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
RFQ
110-91-308-41-105000

데이터시트

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
09-0511-11

09-0511-11

CONN SOCKET SIP 9POS GOLD

Aries Electronics

0 -
RFQ
09-0511-11

데이터시트

511 Bulk Active SIP 9 (1 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
HLS-0214-G-2

HLS-0214-G-2

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
RFQ
HLS-0214-G-2

데이터시트

HLS Tube Active SIP 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
19-71080-10

19-71080-10

CONN SOCKET SIP 19POS TIN

Aries Electronics

0 -
RFQ
19-71080-10

데이터시트

700 Elevator Strip-Line™ Bulk Active SIP 19 (1 x 19) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
19-7375-10

19-7375-10

CONN SOCKET SIP 19POS TIN

Aries Electronics

0 -
RFQ
19-7375-10

데이터시트

700 Elevator Strip-Line™ Bulk Active SIP 19 (1 x 19) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
19-7400-10

19-7400-10

CONN SOCKET SIP 19POS TIN

Aries Electronics

0 -
RFQ
19-7400-10

데이터시트

700 Elevator Strip-Line™ Bulk Active SIP 19 (1 x 19) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
19-7650-10

19-7650-10

CONN SOCKET SIP 19POS TIN

Aries Electronics

0 -
RFQ
19-7650-10

데이터시트

700 Elevator Strip-Line™ Bulk Active SIP 19 (1 x 19) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
19-7750-10

19-7750-10

CONN SOCKET SIP 19POS TIN

Aries Electronics

0 -
RFQ
19-7750-10

데이터시트

700 Elevator Strip-Line™ Bulk Active SIP 19 (1 x 19) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
20-81000-310C

20-81000-310C

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

0 -
RFQ
20-81000-310C

데이터시트

8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
20-81156-310C

20-81156-310C

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

0 -
RFQ
20-81156-310C

데이터시트

8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
20-81200-310C

20-81200-310C

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

0 -
RFQ
20-81200-310C

데이터시트

8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
20-81250-310C

20-81250-310C

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

0 -
RFQ
20-81250-310C

데이터시트

8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
20-8190-310C

20-8190-310C

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

0 -
RFQ
20-8190-310C

데이터시트

8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
20-8240-310C

20-8240-310C

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

0 -
RFQ
20-8240-310C

데이터시트

8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
20-8260-310C

20-8260-310C

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

0 -
RFQ
20-8260-310C

데이터시트

8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
20-8280-310C

20-8280-310C

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

0 -
RFQ
20-8280-310C

데이터시트

8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
20-8300-310C

20-8300-310C

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

0 -
RFQ
20-8300-310C

데이터시트

8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
Total 19086 Record«Prev1... 460461462463464465466467...955Next»
TomatoElec

검색

TomatoElec

제품

TomatoElec

전화번호

TomatoElec

사용자