IC 소켓

제조업체 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도

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결과
사진 제조사 부품 번호 재고 상태 가격 수량 데이터시트 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도
614-93-304-31-002000

614-93-304-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
RFQ
614-93-304-31-002000

데이터시트

614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
20-3518-112

20-3518-112

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

0 -
RFQ
20-3518-112

데이터시트

518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
24-3518-111

24-3518-111

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

0 -
RFQ
24-3518-111

데이터시트

518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
614-93-304-31-007000

614-93-304-31-007000

SOCKET CARRIER LOWPRO .300 4POS

Mill-Max Manufacturing Corp.

0 -
RFQ
614-93-304-31-007000

데이터시트

614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-43-304-31-007000

614-43-304-31-007000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
RFQ
614-43-304-31-007000

데이터시트

614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
APA-318-T-C

APA-318-T-C

ADAPTER PLUG

Samtec Inc.

0 -
RFQ
APA-318-T-C

데이터시트

APA Bulk Active - 18 (2 x 9) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
APO-318-T-C

APO-318-T-C

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
RFQ
APO-318-T-C

데이터시트

APO Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
ICF-640-TL-O

ICF-640-TL-O

.100" SURFACE MOUNT SCREW MACHIN

Samtec Inc.

0 -
RFQ
ICF-640-TL-O

데이터시트

ICF Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
09-0503-21

09-0503-21

CONN SOCKET SIP 9POS GOLD

Aries Electronics

0 -
RFQ
09-0503-21

데이터시트

0503 Bulk Active SIP 9 (1 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled -
40-6518-101

40-6518-101

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

0 -
RFQ
40-6518-101

데이터시트

518 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
612-41-304-41-003000

612-41-304-41-003000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

0 -
RFQ
612-41-304-41-003000

데이터시트

612 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
612-91-304-41-003000

612-91-304-41-003000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

0 -
RFQ
612-91-304-41-003000

데이터시트

612 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-93-304-41-105000

110-93-304-41-105000

CONN IC DIP SOCKET 4POS GOLD

Mill-Max Manufacturing Corp.

0 -
RFQ
110-93-304-41-105000

데이터시트

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-93-304-31-018000

614-93-304-31-018000

SOCKET CARRIER LOWPRO .300 4POS

Mill-Max Manufacturing Corp.

0 -
RFQ
614-93-304-31-018000

데이터시트

614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-43-304-31-018000

614-43-304-31-018000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
RFQ
614-43-304-31-018000

데이터시트

614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
299-83-624-10-002101

299-83-624-10-002101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

0 -
RFQ
299-83-624-10-002101

데이터시트

299 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
ICA-632-WTT

ICA-632-WTT

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
RFQ
ICA-632-WTT

데이터시트

ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
HLS-0208-G-22

HLS-0208-G-22

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
RFQ
HLS-0208-G-22

데이터시트

HLS Tube Active SIP 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
510-87-240-17-061101

510-87-240-17-061101

CONN SOCKET PGA 240POS GOLD

Preci-Dip

0 -
RFQ
510-87-240-17-061101

데이터시트

510 Bulk Active PGA 240 (17 x 17) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
ICO-632-ATT

ICO-632-ATT

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
RFQ
ICO-632-ATT

데이터시트

ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
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