IC 소켓

제조업체 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도

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결과
사진 제조사 부품 번호 재고 상태 가격 수량 데이터시트 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도
10-6823-90

10-6823-90

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

0 -
RFQ
10-6823-90

데이터시트

Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
117-83-668-41-105101

117-83-668-41-105101

CONN IC DIP SOCKET 68POS GOLD

Preci-Dip

0 -
RFQ
117-83-668-41-105101

데이터시트

117 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 68 (2 x 34) 0.070" (1.78mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-87-207-17-081101

510-87-207-17-081101

CONN SOCKET PGA 207POS GOLD

Preci-Dip

0 -
RFQ
510-87-207-17-081101

데이터시트

510 Bulk Active PGA 207 (17 x 17) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-87-207-17-082101

510-87-207-17-082101

CONN SOCKET PGA 207POS GOLD

Preci-Dip

0 -
RFQ
510-87-207-17-082101

데이터시트

510 Bulk Active PGA 207 (17 x 17) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
8060-1G12

8060-1G12

CONN TRANSIST TO-5 4POS GOLD

TE Connectivity AMP Connectors

0 -
RFQ
8060-1G12

데이터시트

8060 Bulk Obsolete Transistor, TO-5 4 (Round) - Gold - Beryllium Copper Through Hole Closed Frame Solder - Gold - Beryllium Copper Fluoropolymer (FP) -55°C ~ 125°C
14-823-90CV0

14-823-90CV0

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

0 -
RFQ

-

Vertisockets™ 800 Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
510-87-233-18-071101

510-87-233-18-071101

CONN SOCKET PGA 233POS GOLD

Preci-Dip

0 -
RFQ
510-87-233-18-071101

데이터시트

510 Bulk Active PGA 233 (18 x 18) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
18-6501-20

18-6501-20

CONN IC DIP SOCKET 18POS TIN

Aries Electronics

0 -
RFQ
18-6501-20

데이터시트

501 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
12-0501-20

12-0501-20

CONN SOCKET SIP 12POS TIN

Aries Electronics

0 -
RFQ
12-0501-20

데이터시트

501 Bulk Active SIP 12 (1 x 12) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
510-83-128-13-041101

510-83-128-13-041101

CONN SOCKET PGA 128POS GOLD

Preci-Dip

0 -
RFQ
510-83-128-13-041101

데이터시트

510 Bulk Active PGA 128 (13 x 13) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-83-128-13-042101

510-83-128-13-042101

CONN SOCKET PGA 128POS GOLD

Preci-Dip

0 -
RFQ
510-83-128-13-042101

데이터시트

510 Bulk Active PGA 128 (13 x 13) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-83-128-13-043101

510-83-128-13-043101

CONN SOCKET PGA 128POS GOLD

Preci-Dip

0 -
RFQ
510-83-128-13-043101

데이터시트

510 Bulk Active PGA 128 (13 x 13) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-83-128-13-071101

510-83-128-13-071101

CONN SOCKET PGA 128POS GOLD

Preci-Dip

0 -
RFQ
510-83-128-13-071101

데이터시트

510 Bulk Active PGA 128 (13 x 13) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
614-41-304-31-012000

614-41-304-31-012000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
RFQ
614-41-304-31-012000

데이터시트

614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-91-304-31-012000

614-91-304-31-012000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
RFQ
614-91-304-31-012000

데이터시트

614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
26-0518-11H

26-0518-11H

CONN SOCKET SIP 26POS GOLD

Aries Electronics

0 -
RFQ
26-0518-11H

데이터시트

518 Bulk Active SIP 26 (1 x 26) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
116-41-304-41-008000

116-41-304-41-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
RFQ
116-41-304-41-008000

데이터시트

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-91-304-41-008000

116-91-304-41-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
RFQ
116-91-304-41-008000

데이터시트

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-41-304-31-002000

614-41-304-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
RFQ
614-41-304-31-002000

데이터시트

614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-91-304-31-002000

614-91-304-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
RFQ
614-91-304-31-002000

데이터시트

614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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