IC 소켓

제조업체 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도

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결과
사진 제조사 부품 번호 재고 상태 가격 수량 데이터시트 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도
940-44-028-24-000000

940-44-028-24-000000

CONN SOCKET PLCC 28POS TIN

Mill-Max Manufacturing Corp.

1,185 -
RFQ
940-44-028-24-000000

데이터시트

940 Tube Active PLCC 28 (4 x 7) 0.100" (2.54mm) Tin 150.0µin (3.81µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
10-810-90C

10-810-90C

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

115 -
RFQ
10-810-90C

데이터시트

Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Vertical Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
40-C212-10

40-C212-10

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

700 -
RFQ
40-C212-10

데이터시트

EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
12-810-90C

12-810-90C

CONN IC DIP SOCKET 12POS GOLD

Aries Electronics

529 -
RFQ
12-810-90C

데이터시트

Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Vertical Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
ICA-640-SGG

ICA-640-SGG

CONN IC DIP SOCKET 40POS GOLD

Samtec Inc.

20 -
RFQ
ICA-640-SGG

데이터시트

ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
346-93-164-41-013000

346-93-164-41-013000

CONN SOCKET SIP 64POS GOLD

Mill-Max Manufacturing Corp.

170 -
RFQ
346-93-164-41-013000

데이터시트

346 Tube Active SIP 64 (1 x 64) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
APA-628-G-N

APA-628-G-N

ADAPTER PLUG

Samtec Inc.

230 -
RFQ
APA-628-G-N

데이터시트

APA Tube Active - 28 (2 x 14) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
20-823-90

20-823-90

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

802 -
RFQ
20-823-90

데이터시트

Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
2350616-1

2350616-1

DUAL LGA,250 POS, DMD SOCKET

TE Connectivity AMP Connectors

296 -
RFQ
2350616-1

데이터시트

- Tray Active LGA 250 (16 x 25) 0.039" (1.00mm) Gold 3.00µin (0.076µm) Copper Alloy Surface Mount Board Guide, Open Frame Solder - - - - Thermoplastic -25°C ~ 100°C
299-43-308-11-001000

299-43-308-11-001000

CONN IC DIP SOCKET 8POS GOLD

Mill-Max Manufacturing Corp.

704 -
RFQ
299-43-308-11-001000

데이터시트

299 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
40-6823-90

40-6823-90

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

246 -
RFQ
40-6823-90

데이터시트

Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
1-2324271-4

1-2324271-4

LEFT SEGMEN LGA4189-4 SOCKET-P4

TE Connectivity AMP Connectors

121 -
RFQ
1-2324271-4

데이터시트

- Tray Active LGA 4189 2092 0.039" (1.00mm) Gold 15.0µin (0.38µm) Copper Alloy Surface Mount Open Frame Solder 0.034" (0.86mm) Gold 15.0µin (0.38µm) Copper Alloy Thermoplastic -25°C ~ 100°C
2-2129710-5

2-2129710-5

CONN SOCKET LGA 3647POS GOLD

TE Connectivity AMP Connectors

171 -
RFQ
2-2129710-5

데이터시트

- Tray Last Time Buy LGA 3647 - Gold 30.0µin (0.76µm) Copper Alloy Surface Mount Open Frame Solder - - - Copper Alloy Thermoplastic -
2-2129710-6

2-2129710-6

CONN SOCKET LGA 3647POS GOLD

TE Connectivity AMP Connectors

249 -
RFQ
2-2129710-6

데이터시트

- Tray Last Time Buy LGA 3647 - Gold 30.0µin (0.76µm) Copper Alloy Surface Mount Open Frame Solder - - - Copper Alloy Thermoplastic -
264-1300-00-0602J

264-1300-00-0602J

CONN IC DIP SOCKET ZIF 64POS GLD

3M

169 -
RFQ
264-1300-00-0602J

데이터시트

Textool™ Tube Active DIP, ZIF (ZIP), 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
24-6554-16

24-6554-16

CONN IC DIP SOCKET ZIF 24POS

Aries Electronics

73 -
RFQ
24-6554-16

데이터시트

55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
2-2822979-3

2-2822979-3

CONN SOCKET LGA 3647POS GOLD

TE Connectivity AMP Connectors

168 -
RFQ
2-2822979-3

데이터시트

- Tray Last Time Buy LGA 3647 0.039" (1.00mm) Gold 30.0µin (0.76µm) Copper Alloy Surface Mount Open Frame Solder 0.034" (0.86mm) Gold 30.0µin (0.76µm) Copper Alloy Thermoplastic -
214-99-308-01-670800

214-99-308-01-670800

CONN IC DIP SOCKET 8POS TIN-LEAD

Mill-Max Manufacturing Corp.

1,068 -
RFQ
214-99-308-01-670800

데이터시트

214 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
114-87-310-41-134191

114-87-310-41-134191

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

2,944 -
RFQ
114-87-310-41-134191

데이터시트

114 Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-47-210-41-006000

116-47-210-41-006000

CONN IC DIP SOCKET 10POS GOLD

Mill-Max Manufacturing Corp.

2,142 -
RFQ
116-47-210-41-006000

데이터시트

116 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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