IC 소켓

제조업체 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도

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결과
사진 제조사 부품 번호 재고 상태 가격 수량 데이터시트 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도
214-99-624-01-670800

214-99-624-01-670800

CONN IC DIP SOCKET 24POS TINLEAD

Mill-Max Manufacturing Corp.

307 -
RFQ
214-99-624-01-670800

데이터시트

214 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-93-308-31-012000

614-93-308-31-012000

CONN IC DIP SOCKET 8POS GOLD

Mill-Max Manufacturing Corp.

284 -
RFQ
614-93-308-31-012000

데이터시트

614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-43-308-31-012000

614-43-308-31-012000

CONN IC DIP SOCKET 8POS GOLD

Mill-Max Manufacturing Corp.

261 -
RFQ
614-43-308-31-012000

데이터시트

614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
D2828-42

D2828-42

CONN IC DIP SOCKET 28POS GOLD

Harwin Inc.

229 -
RFQ
D2828-42

데이터시트

D2 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 196.9µin (5.00µm) Brass Plastic -55°C ~ 125°C
D2928-42

D2928-42

CONN IC DIP SOCKET 28POS GOLD

Harwin Inc.

193 -
RFQ
D2928-42

데이터시트

D2 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 196.9µin (5.00µm) Brass Plastic -55°C ~ 125°C
24-4518-10

24-4518-10

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

508 -
RFQ
24-4518-10

데이터시트

518 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
210-43-624-41-001000

210-43-624-41-001000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.

158 -
RFQ
210-43-624-41-001000

데이터시트

210 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
115-43-422-41-003000

115-43-422-41-003000

CONN IC DIP SOCKET 22POS GOLD

Mill-Max Manufacturing Corp.

1,873 -
RFQ
115-43-422-41-003000

데이터시트

115 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
115-43-320-41-001000

115-43-320-41-001000

CONN IC DIP SOCKET 20POS GOLD

Mill-Max Manufacturing Corp.

232 -
RFQ
115-43-320-41-001000

데이터시트

115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
117-87-642-41-005101

117-87-642-41-005101

CONN IC DIP SOCKET 42POS GOLD

Preci-Dip

522 -
RFQ
117-87-642-41-005101

데이터시트

117 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.070" (1.78mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-87-320-41-008101

116-87-320-41-008101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

360 -
RFQ
116-87-320-41-008101

데이터시트

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
XR2A-1801-N

XR2A-1801-N

CONN IC DIP SOCKET 18POS GOLD

Omron Electronics Inc-EMC Div

151 -
RFQ
XR2A-1801-N

데이터시트

XR2 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 125°C
111-43-320-41-001000

111-43-320-41-001000

CONN IC DIP SOCKET 20POS GOLD

Mill-Max Manufacturing Corp.

200 -
RFQ
111-43-320-41-001000

데이터시트

111 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
917-43-210-41-005000

917-43-210-41-005000

CONN SOCKET TRANSIST TO100 10POS

Mill-Max Manufacturing Corp.

313 -
RFQ
917-43-210-41-005000

데이터시트

917 Tube Active Transistor, TO-100 10 (Round) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder - Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
D2924-42

D2924-42

CONN IC DIP SOCKET 24POS GOLD

Harwin Inc.

225 -
RFQ
D2924-42

데이터시트

D2 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 196.9µin (5.00µm) Brass Plastic -55°C ~ 125°C
D2832-42

D2832-42

CONN IC DIP SOCKET 32POS GOLD

Harwin Inc.

577 -
RFQ
D2832-42

데이터시트

D2 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 196.9µin (5.00µm) Brass Plastic -55°C ~ 125°C
ICA-628-STT

ICA-628-STT

CONN IC DIP SOCKET 28POS TIN

Samtec Inc.

8 -
RFQ
ICA-628-STT

데이터시트

ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
ICA-324-SST

ICA-324-SST

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

748 -
RFQ
ICA-324-SST

데이터시트

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 125°C
4591

4591

CONN TRANSIST TO-5 4POS TIN

Keystone Electronics

1,844 -
RFQ
4591

데이터시트

- Bulk Active Transistor, TO-5 4 (Round) - Tin - Brass Chassis Mount Closed Frame Solder - Tin - Brass Polyester, Glass Filled -
16-0518-00

16-0518-00

CONN SOCKET SIP 16POS GOLD

Aries Electronics

167 -
RFQ
16-0518-00

데이터시트

518 Bulk Active SIP 16 (1 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
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