IC 소켓

제조업체 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도

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결과
사진 제조사 부품 번호 재고 상태 가격 수량 데이터시트 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도
C9122-00

C9122-00

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics

0 -
RFQ
C9122-00

데이터시트

Edge-Grip™, C91 Bulk Obsolete DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
HLS-0116-T-2

HLS-0116-T-2

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
RFQ
HLS-0116-T-2

데이터시트

HLS Tube Active SIP 16 (1 x 16) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
299-87-320-11-001101

299-87-320-11-001101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

0 -
RFQ
299-87-320-11-001101

데이터시트

299 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
IC-628-SGT

IC-628-SGT

CONN IC DIP SOCKET 28POS GOLD

Samtec Inc.

0 -
RFQ
IC-628-SGT

데이터시트

IC Bulk Obsolete DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyester, Glass Filled -55°C ~ 125°C
510-83-073-11-061101

510-83-073-11-061101

CONN SOCKET PGA 73POS GOLD

Preci-Dip

0 -
RFQ
510-83-073-11-061101

데이터시트

510 Bulk Active PGA 73 (11 x 11) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-83-628-41-009101

116-83-628-41-009101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

0 -
RFQ
116-83-628-41-009101

데이터시트

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
08-2501-20

08-2501-20

CONN IC DIP SOCKET 8POS TIN

Aries Electronics

0 -
RFQ
08-2501-20

데이터시트

501 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
116-83-424-41-011101

116-83-424-41-011101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

0 -
RFQ
116-83-424-41-011101

데이터시트

116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
ICA-318-ZSGT

ICA-318-ZSGT

CONN IC DIP SOCKET 18POS GOLD

Samtec Inc.

0 -
RFQ
ICA-318-ZSGT

데이터시트

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
ICO-318-ZSGT

ICO-318-ZSGT

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
RFQ
ICO-318-ZSGT

데이터시트

ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
08-0501-20

08-0501-20

CONN SOCKET SIP 8POS TIN

Aries Electronics

0 -
RFQ
08-0501-20

데이터시트

501 Bulk Active SIP 8 (1 x 8) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
08-0501-30

08-0501-30

CONN SOCKET SIP 8POS TIN

Aries Electronics

0 -
RFQ
08-0501-30

데이터시트

501 Bulk Active SIP 8 (1 x 8) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
116-87-318-41-013101

116-87-318-41-013101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip

0 -
RFQ
116-87-318-41-013101

데이터시트

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
ICF-320-F-O

ICF-320-F-O

.100" SURFACE MOUNT SCREW MACHIN

Samtec Inc.

0 -
RFQ
ICF-320-F-O

데이터시트

ICF Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 3.00µin (0.076µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
510-87-121-15-001101

510-87-121-15-001101

CONN SOCKET PGA 121POS GOLD

Preci-Dip

0 -
RFQ
510-87-121-15-001101

데이터시트

510 Bulk Active PGA 121 (15 x 15) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-87-121-15-061101

510-87-121-15-061101

CONN SOCKET PGA 121POS GOLD

Preci-Dip

0 -
RFQ
510-87-121-15-061101

데이터시트

510 Bulk Active PGA 121 (15 x 15) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-87-328-41-011101

116-87-328-41-011101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

0 -
RFQ
116-87-328-41-011101

데이터시트

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
05-0503-21

05-0503-21

CONN SOCKET SIP 5POS GOLD

Aries Electronics

0 -
RFQ
05-0503-21

데이터시트

0503 Bulk Active SIP 5 (1 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled -
20-4518-10H

20-4518-10H

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

0 -
RFQ
20-4518-10H

데이터시트

518 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
HLS-0109-G-10

HLS-0109-G-10

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
RFQ
HLS-0109-G-10

데이터시트

HLS Tube Active SIP 9 (1 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
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