IC 소켓

제조업체 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도

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결과
사진 제조사 부품 번호 재고 상태 가격 수량 데이터시트 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도
116-87-636-41-007101

116-87-636-41-007101

CONN IC DIP SOCKET 36POS GOLD

Preci-Dip

0 -
RFQ
116-87-636-41-007101

데이터시트

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
346-93-113-41-013000

346-93-113-41-013000

CONN SOCKET SIP 13POS GOLD

Mill-Max Manufacturing Corp.

0 -
RFQ
346-93-113-41-013000

데이터시트

346 Bulk Active SIP 13 (1 x 13) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
346-43-113-41-013000

346-43-113-41-013000

CONN SOCKET SIP 13POS GOLD

Mill-Max Manufacturing Corp.

0 -
RFQ
346-43-113-41-013000

데이터시트

346 Bulk Active SIP 13 (1 x 13) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
124-83-424-41-002101

124-83-424-41-002101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

0 -
RFQ

-

124 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
18-3513-10H

18-3513-10H

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

0 -
RFQ
18-3513-10H

데이터시트

Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
24-6513-11

24-6513-11

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

0 -
RFQ
24-6513-11

데이터시트

Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
115-83-650-41-003101

115-83-650-41-003101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip

0 -
RFQ
115-83-650-41-003101

데이터시트

115 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
3-1571552-4

3-1571552-4

CONN IC DIP SOCKET 48POS GOLD

TE Connectivity AMP Connectors

0 -
RFQ
3-1571552-4

데이터시트

800 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 105°C
HLS-0112-T-10

HLS-0112-T-10

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
RFQ
HLS-0112-T-10

데이터시트

HLS Tube Active SIP 12 (1 x 12) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
510-83-072-11-061101

510-83-072-11-061101

CONN SOCKET PGA 72POS GOLD

Preci-Dip

0 -
RFQ
510-83-072-11-061101

데이터시트

510 Bulk Active PGA 72 (11 x 11) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
HLS-0204-G-10

HLS-0204-G-10

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
RFQ
HLS-0204-G-10

데이터시트

HLS Tube Active SIP 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
211-1-48-006

211-1-48-006

CONN IC DIP SOCKET 48POS GOLD

CNC Tech

0 -
RFQ
211-1-48-006

데이터시트

- Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT) -55°C ~ 105°C
124-83-624-41-002101

124-83-624-41-002101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

0 -
RFQ

-

124 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
299-87-320-10-001101

299-87-320-10-001101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

0 -
RFQ
299-87-320-10-001101

데이터시트

299 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
HLS-0105-G-3

HLS-0105-G-3

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
RFQ
HLS-0105-G-3

데이터시트

HLS Tube Active SIP 5 (1 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
8-1437539-9

8-1437539-9

CONN IC DIP SOCKET 28POS GOLD

TE Connectivity AMP Connectors

0 -
RFQ
8-1437539-9

데이터시트

800 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) - - - Polyester -55°C ~ 105°C
110-83-952-41-001101

110-83-952-41-001101

CONN IC DIP SOCKET 52POS GOLD

Preci-Dip

0 -
RFQ
110-83-952-41-001101

데이터시트

110 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
ICA-632-ZSTT

ICA-632-ZSTT

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
RFQ
ICA-632-ZSTT

데이터시트

ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
510-87-124-13-001101

510-87-124-13-001101

CONN SOCKET PGA 124POS GOLD

Preci-Dip

0 -
RFQ
510-87-124-13-001101

데이터시트

510 Bulk Active PGA 124 (13 x 13) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-87-124-13-041101

510-87-124-13-041101

CONN SOCKET PGA 124POS GOLD

Preci-Dip

0 -
RFQ
510-87-124-13-041101

데이터시트

510 Bulk Active PGA 124 (13 x 13) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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