IC 소켓

제조업체 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도

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결과
사진 제조사 부품 번호 재고 상태 가격 수량 데이터시트 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도
110-87-636-41-105101

110-87-636-41-105101

CONN IC DIP SOCKET 36POS GOLD

Preci-Dip

0 -
RFQ
110-87-636-41-105101

데이터시트

110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-83-210-41-004101

116-83-210-41-004101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0 -
RFQ
116-83-210-41-004101

데이터시트

116 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-87-610-41-013101

116-87-610-41-013101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0 -
RFQ
116-87-610-41-013101

데이터시트

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
117-87-648-41-005101

117-87-648-41-005101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip

0 -
RFQ
117-87-648-41-005101

데이터시트

117 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.070" (1.78mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
1-1437542-0

1-1437542-0

CONN IC DIP SOCKET 8POS GOLD

TE Connectivity AMP Connectors

0 -
RFQ
1-1437542-0

데이터시트

700 - Obsolete DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Beryllium Copper Through Hole Carrier, Closed Frame Solder 0.100" (2.54mm) Gold 20.0µin (0.51µm) Beryllium Copper Aluminum Alloy -55°C ~ 125°C
110-87-314-41-105191

110-87-314-41-105191

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip

0 -
RFQ

-

110 Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
HLS-0104-G-32

HLS-0104-G-32

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
RFQ
HLS-0104-G-32

데이터시트

HLS Bulk Active SIP 4 (1 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
614-87-636-41-001101

614-87-636-41-001101

CONN IC DIP SOCKET 36POS GOLD

Preci-Dip

0 -
RFQ
614-87-636-41-001101

데이터시트

614 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-87-320-41-001101

116-87-320-41-001101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

0 -
RFQ
116-87-320-41-001101

데이터시트

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
528-AG11D-ES

528-AG11D-ES

CONN IC DIP SOCKET 28POS GOLD

TE Connectivity AMP Connectors

0 -
RFQ
528-AG11D-ES

데이터시트

500 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead - Copper Alloy Polyester -55°C ~ 105°C
116-87-318-41-011101

116-87-318-41-011101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip

0 -
RFQ
116-87-318-41-011101

데이터시트

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
ICA-308-WTT-3

ICA-308-WTT-3

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
RFQ
ICA-308-WTT-3

데이터시트

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
116-83-624-41-006101

116-83-624-41-006101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

0 -
RFQ
116-83-624-41-006101

데이터시트

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
500-032-050

500-032-050

CONN SOCKET SIP 32POS GOLD

3M

0 -
RFQ
500-032-050

데이터시트

- Box Obsolete SIP 32 (1 x 32) 0.100" (2.54mm) Gold 8.00µin (0.203µm) - Through Hole Closed Frame - 0.100" (2.54mm) Gold 8.00µin (0.203µm) - - -
110-83-632-41-005101

110-83-632-41-005101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

0 -
RFQ
110-83-632-41-005101

데이터시트

110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
110-83-632-41-605101

110-83-632-41-605101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

0 -
RFQ
110-83-632-41-605101

데이터시트

110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
540-88-084-24-008

540-88-084-24-008

CONN SOCKET PLCC 84POS TIN

Preci-Dip

0 -
RFQ
540-88-084-24-008

데이터시트

540 Bulk Active PLCC 84 (4 x 21) 0.050" (1.27mm) Tin - Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polyphenylene Sulfide (PPS) -
21-0513-10

21-0513-10

CONN SOCKET SIP 21POS GOLD

Aries Electronics

0 -
RFQ
21-0513-10

데이터시트

0513 Bulk Active SIP 21 (1 x 21) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
11-0513-11H

11-0513-11H

CONN SOCKET SIP 11POS GOLD

Aries Electronics

0 -
RFQ
11-0513-11H

데이터시트

0513 Bulk Active SIP 11 (1 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
23-0513-10T

23-0513-10T

CONN SOCKET SIP 23POS GOLD

Aries Electronics

0 -
RFQ
23-0513-10T

데이터시트

0513 Bulk Active SIP 23 (1 x 23) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
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