IC 소켓

제조업체 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도

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결과
사진 제조사 부품 번호 재고 상태 가격 수량 데이터시트 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도
124-83-314-41-002101

124-83-314-41-002101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip

0 -
RFQ

-

124 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
122-87-422-41-001101

122-87-422-41-001101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

0 -
RFQ
122-87-422-41-001101

데이터시트

122 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-87-632-41-006101

116-87-632-41-006101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

0 -
RFQ
116-87-632-41-006101

데이터시트

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
14-3513-00

14-3513-00

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

0 -
RFQ
14-3513-00

데이터시트

Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
117-87-448-41-005101

117-87-448-41-005101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip

0 -
RFQ
117-87-448-41-005101

데이터시트

117 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 48 (2 x 24) 0.070" (1.78mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
110-83-424-41-105101

110-83-424-41-105101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

0 -
RFQ
110-83-424-41-105101

데이터시트

110 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
117-87-628-41-105101

117-87-628-41-105101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

0 -
RFQ
117-87-628-41-105101

데이터시트

117 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.070" (1.78mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
DIP050-628-160B

DIP050-628-160B

DIP SOCKET 28 CTS

Amphenol ICC (FCI)

0 -
RFQ
DIP050-628-160B

데이터시트

- Bag Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
614-83-322-31-012101

614-83-322-31-012101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

0 -
RFQ
614-83-322-31-012101

데이터시트

614 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
614-83-422-31-012101

614-83-422-31-012101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

0 -
RFQ
614-83-422-31-012101

데이터시트

614 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
110-87-652-41-005101

110-87-652-41-005101

CONN IC DIP SOCKET 52POS GOLD

Preci-Dip

0 -
RFQ
110-87-652-41-005101

데이터시트

110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
06-6513-11H

06-6513-11H

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics

0 -
RFQ
06-6513-11H

데이터시트

Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
24-0518-10H

24-0518-10H

CONN SOCKET SIP 24POS GOLD

Aries Electronics

0 -
RFQ
24-0518-10H

데이터시트

518 Bulk Active SIP 24 (1 x 24) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
24-1518-10H

24-1518-10H

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

0 -
RFQ
24-1518-10H

데이터시트

518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
AR40-HZL/07-TT

AR40-HZL/07-TT

CONN IC DIP SOCKET 40POS GOLD

Assmann WSW Components

0 -
RFQ
AR40-HZL/07-TT

데이터시트

- Bag Obsolete DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
XR2C-1611-N

XR2C-1611-N

CONN SOCKET SIP 16POS GOLD

Omron Electronics Inc-EMC Div

0 -
RFQ
XR2C-1611-N

데이터시트

XR2 Bulk Active SIP 16 (1 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 125°C
116-83-324-41-006101

116-83-324-41-006101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

0 -
RFQ
116-83-324-41-006101

데이터시트

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
ICO-308-ZSST

ICO-308-ZSST

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
RFQ
ICO-308-ZSST

데이터시트

ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 125°C
116-87-324-41-007101

116-87-324-41-007101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

0 -
RFQ
116-87-324-41-007101

데이터시트

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
ICA-308-ZSGT

ICA-308-ZSGT

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
RFQ
ICA-308-ZSGT

데이터시트

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
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