IC 소켓

제조업체 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도

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결과
사진 제조사 부품 번호 재고 상태 가격 수량 데이터시트 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도
614-87-314-31-012101

614-87-314-31-012101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip

0 -
RFQ
614-87-314-31-012101

데이터시트

614 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
05-0513-10H

05-0513-10H

CONN SOCKET SIP 5POS GOLD

Aries Electronics

0 -
RFQ
05-0513-10H

데이터시트

0513 Bulk Active SIP 5 (1 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
110-87-624-41-005101

110-87-624-41-005101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

0 -
RFQ
110-87-624-41-005101

데이터시트

110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
110-87-624-41-605101

110-87-624-41-605101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

0 -
RFQ
110-87-624-41-605101

데이터시트

110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
AR48-HZL-TT

AR48-HZL-TT

CONN IC DIP SOCKET 48POS TIN

Assmann WSW Components

0 -
RFQ
AR48-HZL-TT

데이터시트

- Bag Obsolete DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
A-CCS52-G

A-CCS52-G

CONN SOCKET PLCC 52POS GOLD

Assmann WSW Components

0 -
RFQ
A-CCS52-G

데이터시트

- Bag Obsolete PLCC 52 (4 x 13) 0.050" (1.27mm) Gold - Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 105°C
612-87-316-41-001101

612-87-316-41-001101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

0 -
RFQ
612-87-316-41-001101

데이터시트

612 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-87-308-41-011101

116-87-308-41-011101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip

0 -
RFQ
116-87-308-41-011101

데이터시트

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
115-87-322-41-001101

115-87-322-41-001101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

0 -
RFQ

-

115 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
AR 52-HGL-TT

AR 52-HGL-TT

SOCKET

Assmann WSW Components

0 -
RFQ

-

AR Bulk Active DIP, 0.6" (15.24mm) Row Spacing 52 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
06-6513-10

06-6513-10

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics

0 -
RFQ
06-6513-10

데이터시트

Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
08-3513-10T

08-3513-10T

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

0 -
RFQ
08-3513-10T

데이터시트

Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
08-6513-10T

08-6513-10T

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

0 -
RFQ
08-6513-10T

데이터시트

Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
07-0518-00

07-0518-00

CONN SOCKET SIP 7POS GOLD

Aries Electronics

0 -
RFQ
07-0518-00

데이터시트

518 Bulk Active SIP 7 (1 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
11-0518-10T

11-0518-10T

CONN SOCKET SIP 11POS GOLD

Aries Electronics

0 -
RFQ
11-0518-10T

데이터시트

518 Bulk Active SIP 11 (1 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
ED068PLCZ-SM-N

ED068PLCZ-SM-N

CONN SOCKET PLCC 68POS

On Shore Technology Inc.

0 -
RFQ
ED068PLCZ-SM-N

데이터시트

ED Tube Active PLCC 68 (2 x 34) 0.050" (1.27mm) - - Phosphor Bronze Surface Mount Closed Frame Solder 0.050" (1.27mm) - - Phosphor Bronze Polyphenylene Sulfide (PPS) -55°C ~ 105°C
A-CCS68-G

A-CCS68-G

CONN SOCKET PLCC 68POS GOLD

Assmann WSW Components

0 -
RFQ
A-CCS68-G

데이터시트

- Bag Obsolete PLCC 68 (4 x 17) 0.050" (1.27mm) Gold - Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 105°C
1-1437535-9

1-1437535-9

CONN IC DIP SOCKET 8POS TIN

TE Connectivity AMP Connectors

0 -
RFQ
1-1437535-9

데이터시트

500 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Brass - -55°C ~ 105°C
A28-LCG-T-R

A28-LCG-T-R

CONN IC DIP SOCKET 28POS GOLD

Assmann WSW Components

0 -
RFQ
A28-LCG-T-R

데이터시트

- Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold - - Through Hole Open Frame Solder 0.100" (2.54mm) Gold - - Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 105°C
506-AG12D-LF

506-AG12D-LF

CONN IC DIP SOCKET 6POS TIN

TE Connectivity AMP Connectors

0 -
RFQ
506-AG12D-LF

데이터시트

500 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 105°C
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