IC 소켓

제조업체 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도

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결과
사진 제조사 부품 번호 재고 상태 가격 수량 데이터시트 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도
110-83-314-41-005101

110-83-314-41-005101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip

0 -
RFQ
110-83-314-41-005101

데이터시트

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
110-83-314-41-605101

110-83-314-41-605101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip

0 -
RFQ
110-83-314-41-605101

데이터시트

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
614-87-316-41-001101

614-87-316-41-001101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

0 -
RFQ
614-87-316-41-001101

데이터시트

614 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-87-314-41-018101

116-87-314-41-018101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip

0 -
RFQ
116-87-314-41-018101

데이터시트

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-83-308-41-007101

116-83-308-41-007101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip

0 -
RFQ
116-83-308-41-007101

데이터시트

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
110-83-316-01-931101

110-83-316-01-931101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

0 -
RFQ
110-83-316-01-931101

데이터시트

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8), 8 Loaded 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
HLS-0104-T-2

HLS-0104-T-2

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
RFQ
HLS-0104-T-2

데이터시트

HLS Tube Active SIP 4 (1 x 4) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
110-87-428-41-001101

110-87-428-41-001101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

0 -
RFQ
110-87-428-41-001101

데이터시트

110 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-87-210-41-018101

116-87-210-41-018101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0 -
RFQ
116-87-210-41-018101

데이터시트

116 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
114-83-310-41-134191

114-83-310-41-134191

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0 -
RFQ
114-83-310-41-134191

데이터시트

114 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-83-310-41-018101

116-83-310-41-018101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0 -
RFQ
116-83-310-41-018101

데이터시트

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
07-0513-10T

07-0513-10T

CONN SOCKET SIP 7POS GOLD

Aries Electronics

0 -
RFQ
07-0513-10T

데이터시트

0513 Bulk Active SIP 7 (1 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
0784990002

0784990002

CONN CAM SOCKET 24POS GOLD

Molex

0 -
RFQ
0784990002

데이터시트

78499 Tape & Reel (TR) Obsolete Camera Socket 24 (2 x 4, 2 x 8) 0.024" (0.60mm) Gold 12.0µin (0.30µm) Copper Alloy Surface Mount Closed Frame Solder 0.024" (0.60mm) Gold Flash Copper Alloy Plastic -55°C ~ 85°C
08-3513-10

08-3513-10

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

0 -
RFQ
08-3513-10

데이터시트

Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
SIP050-1X13-160B

SIP050-1X13-160B

1X13-160B-SIP SOCKET 13 CTS

Amphenol ICC (FCI)

0 -
RFQ
SIP050-1X13-160B

데이터시트

SIP050-1x Bulk Active SIP 13 (1 x 13) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
110-87-424-41-005101

110-87-424-41-005101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

0 -
RFQ
110-87-424-41-005101

데이터시트

110 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
540-99-032-17-400200

540-99-032-17-400200

CONN SOCKET PLCC 32POS TIN-LEAD

Mill-Max Manufacturing Corp.

0 -
RFQ
540-99-032-17-400200

데이터시트

540 Tube Obsolete PLCC 32 (2 x 7, 2 x 9) 0.050" (1.27mm) Tin-Lead 200.0µin (5.08µm) - Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin-Lead 200.0µin (5.08µm) - Polyphenylene Sulfide (PPS) -
540-99-028-24-000000

540-99-028-24-000000

CONN SOCKET PLCC 28POS TIN-LEAD

Mill-Max Manufacturing Corp.

0 -
RFQ
540-99-028-24-000000

데이터시트

540 Tube Obsolete PLCC 28 (4 x 7) 0.050" (1.27mm) Tin-Lead 200.0µin (5.08µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) - Polyphenylene Sulfide (PPS) -
AR 50-HGL-TT

AR 50-HGL-TT

SOCKET

Assmann WSW Components

0 -
RFQ

-

AR Bulk Active DIP, 0.6" (15.24mm) Row Spacing 50 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
ED032PLCZ

ED032PLCZ

CONN SOCKET PLCC 32POS TIN

On Shore Technology Inc.

0 -
RFQ
ED032PLCZ

데이터시트

ED Tube Active PLCC 32 (2 x 16) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT) -55°C ~ 105°C
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