IC 소켓

제조업체 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도

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결과
사진 제조사 부품 번호 재고 상태 가격 수량 데이터시트 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도
116-87-310-41-003101

116-87-310-41-003101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0 -
RFQ
116-87-310-41-003101

데이터시트

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
614-87-210-41-001101

614-87-210-41-001101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0 -
RFQ
614-87-210-41-001101

데이터시트

614 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
1825410-8

1825410-8

CONN SOCKET SIP 8POS GOLD

TE Connectivity AMP Connectors

0 -
RFQ

-

Diplomate DL Tray Obsolete SIP 8 (1 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Thermoplastic, Glass Filled -55°C ~ 125°C
110-87-312-41-105101

110-87-312-41-105101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip

0 -
RFQ
110-87-312-41-105101

데이터시트

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
AW 127-40/Z-T

AW 127-40/Z-T

SOCKET 40 CONTACTS SINGLE ROW

Assmann WSW Components

0 -
RFQ
AW 127-40/Z-T

데이터시트

- - Active - - - - - - - - - - - - - - -
SIP1X21-011B

SIP1X21-011B

SIP1X21-011B-SIP SOCKET 21 CTS

Amphenol ICC (FCI)

0 -
RFQ
SIP1X21-011B

데이터시트

SIP1x Bulk Active SIP 21 (1 x 21) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
614-87-610-31-012101

614-87-610-31-012101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0 -
RFQ
614-87-610-31-012101

데이터시트

614 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
3-822516-3

3-822516-3

CONN SOCKET PLCC 20POS TIN

TE Connectivity AMP Connectors

0 -
RFQ
3-822516-3

데이터시트

- Tape & Reel (TR) Obsolete PLCC 20 (4 x 5) 0.050" (1.27mm) Tin 100.0µin (2.54µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 100.0µin (2.54µm) Phosphor Bronze Thermoplastic -
116-87-308-41-007101

116-87-308-41-007101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip

0 -
RFQ
116-87-308-41-007101

데이터시트

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
110-83-314-10-001101

110-83-314-10-001101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip

0 -
RFQ
110-83-314-10-001101

데이터시트

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
110-83-210-41-005101

110-83-210-41-005101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0 -
RFQ
110-83-210-41-005101

데이터시트

110 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
110-87-316-01-931101

110-87-316-01-931101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

0 -
RFQ
110-87-316-01-931101

데이터시트

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8), 8 Loaded 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
110-87-316-10-003101

110-87-316-10-003101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

0 -
RFQ
110-87-316-10-003101

데이터시트

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8), 8 Loaded 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-83-308-41-006101

116-83-308-41-006101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip

0 -
RFQ
116-83-308-41-006101

데이터시트

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
110-83-312-41-001101

110-83-312-41-001101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip

0 -
RFQ
110-83-312-41-001101

데이터시트

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
D0808-01

D0808-01

CONN IC DIP SOCKET 8POS GOLD

Harwin Inc.

0 -
RFQ
D0808-01

데이터시트

D0 Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 196.9µin (5.00µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
06-0513-10

06-0513-10

CONN SOCKET SIP 6POS GOLD

Aries Electronics

0 -
RFQ
06-0513-10

데이터시트

0513 Bulk Active SIP 6 (1 x 6) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
02-0508-20

02-0508-20

CONN SOCKET SIP 2POS GOLD

Aries Electronics

0 -
RFQ
02-0508-20

데이터시트

508 Bulk Active SIP 2 (1 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
02-1508-20

02-1508-20

CONN IC DIP SOCKET 2POS GOLD

Aries Electronics

0 -
RFQ
02-1508-20

데이터시트

508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 2 (1 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
110-83-310-41-005101

110-83-310-41-005101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0 -
RFQ
110-83-310-41-005101

데이터시트

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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