IC 소켓

제조업체 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도

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결과
사진 제조사 부품 번호 재고 상태 가격 수량 데이터시트 시리즈 패키징 제품 상태 유형 위치 또는 핀 수(그리드) 피치 - Mating 접촉 마감 - 결합 접촉 마감 두께 - Mating 접촉 재료 - Mating 장착 유형 기능 종단 피치 - 포스트 접촉 마감 - 포스트 접촉 마감 두께 - 포스트 접촉 재료 - 포스트 하우징 소재 작동 온도
1825094-3

1825094-3

CONN IC DIP SOCKET 14POS GOLD

TE Connectivity AMP Connectors

0 -
RFQ
1825094-3

데이터시트

Diplomate DL Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Thermoplastic, Glass Filled -55°C ~ 125°C
8060-1G7

8060-1G7

CONN TRANSIST TO-5 3POS GOLD

TE Connectivity AMP Connectors

0 -
RFQ
8060-1G7

데이터시트

8060 Bulk Active Transistor, TO-5 3 (Round) - Gold - Beryllium Copper Through Hole Closed Frame Solder - Gold - Beryllium Copper Polytetrafluoroethylene (PTFE) -55°C ~ 125°C
2-1571994-0

2-1571994-0

CONN SOCKET SIP 20POS GOLD

TE Connectivity AMP Connectors

0 -
RFQ
2-1571994-0

데이터시트

510 Tube Obsolete SIP 20 (1 x 20) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 20.0µin (0.51µm) Copper Thermoplastic, Polyester -
1825374-3

1825374-3

CONN IC DIP SOCKET 14POS GOLD

TE Connectivity AMP Connectors

0 -
RFQ
1825374-3

데이터시트

Diplomate DL Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Thermoplastic, Glass Filled -55°C ~ 125°C
1-822473-1

1-822473-1

CONN SOCKET PLCC 20POS TIN

TE Connectivity AMP Connectors

0 -
RFQ
1-822473-1

데이터시트

- Tube Obsolete PLCC 20 (4 x 5) 0.050" (1.27mm) Tin 100.0µin (2.54µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 100.0µin (2.54µm) Phosphor Bronze Thermoplastic -
2-382713-1

2-382713-1

CONN IC DIP SOCKET 18POS TIN

TE Connectivity AMP Connectors

0 -
RFQ
2-382713-1

데이터시트

Diplomate DL Box Active DIP, 0.6" (15.24mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Thermoplastic, Glass Filled -55°C ~ 105°C
2-382718-8

2-382718-8

CONN IC DIP SOCKET 28POS TIN

TE Connectivity AMP Connectors

0 -
RFQ
2-382718-8

데이터시트

Diplomate DL Box Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Thermoplastic, Glass Filled -55°C ~ 105°C
2-382724-1

2-382724-1

CONN IC DIP SOCKET 40POS TIN

TE Connectivity AMP Connectors

0 -
RFQ
2-382724-1

데이터시트

Diplomate DL Box Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Thermoplastic, Glass Filled -55°C ~ 105°C
1571550-7

1571550-7

CONN IC DIP SOCKET 22POS TIN

TE Connectivity AMP Connectors

0 -
RFQ
1571550-7

데이터시트

500 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 105°C
2-1571550-7

2-1571550-7

CONN IC DIP SOCKET 22POS GOLD

TE Connectivity AMP Connectors

0 -
RFQ
2-1571550-7

데이터시트

500 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 25.0µin (0.63µm) Beryllium Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
3-1571550-0

3-1571550-0

CONN IC DIP SOCKET 32POS GOLD

TE Connectivity AMP Connectors

0 -
RFQ
3-1571550-0

데이터시트

500 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 25.0µin (0.63µm) Beryllium Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
3-1571550-1

3-1571550-1

CONN IC DIP SOCKET 36POS GOLD

TE Connectivity AMP Connectors

0 -
RFQ
3-1571550-1

데이터시트

500 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 25.0µin (0.63µm) Beryllium Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
506-AG11D-ESL-LF

506-AG11D-ESL-LF

CONN IC DIP SOCKET 6POS GOLD

TE Connectivity AMP Connectors

0 -
RFQ
506-AG11D-ESL-LF

데이터시트

500 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold Flash Nickel Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
3-1571551-0

3-1571551-0

CONN IC DIP SOCKET 32POS GOLD

TE Connectivity AMP Connectors

0 -
RFQ
3-1571551-0

데이터시트

500 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold Flash Nickel Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
5-1571552-1

5-1571552-1

CONN IC DIP SOCKET 36POS GOLD

TE Connectivity AMP Connectors

0 -
RFQ
5-1571552-1

데이터시트

800 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 20.0µin (0.51µm) Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 105°C
824-AG32D-LF

824-AG32D-LF

CONN IC DIP SOCKET 24POS TIN

TE Connectivity AMP Connectors

0 -
RFQ
824-AG32D-LF

데이터시트

800 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 105°C
1-1825108-3

1-1825108-3

CONN IC DIP SOCKET 40POS GOLD

TE Connectivity AMP Connectors

0 -
RFQ

-

Diplomate DL Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Thermoplastic, Glass Filled -55°C ~ 125°C
3-1825276-2

3-1825276-2

CONN IC DIP SOCKET 32POS GOLD

TE Connectivity AMP Connectors

0 -
RFQ
3-1825276-2

데이터시트

Diplomate DL Tray Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Thermoplastic, Glass Filled -55°C ~ 125°C
643645-3

643645-3

CONN SOCKET SIP 13POS TIN

TE Connectivity AMP Connectors

0 -
RFQ
643645-3

데이터시트

Diplomate DL Tray Obsolete SIP 13 (1 x 13) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Thermoplastic, Glass Filled -55°C ~ 105°C
510-AG90D-10

510-AG90D-10

CONN SOCKET SIP 10POS GOLD

TE Connectivity AMP Connectors

0 -
RFQ
510-AG90D-10

데이터시트

500 Tube Obsolete SIP 10 (1 x 10) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold - Beryllium Copper Thermoplastic -
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